Synergistic effects of alloy elements on the structural stability, mechanical properties and electronic structure of Ni3Sn4: Using first principles
Y Han, J Chen, M Lin, K Zhang, H Lu - Vacuum, 2023 - Elsevier
Abstract Ni 3 Sn 4 and Ni 3 Sn 4-based ternary phases play an important role in the
interfacial connection in solder joints. In this study, we provide a detailed investigation of the …
interfacial connection in solder joints. In this study, we provide a detailed investigation of the …
Inhibiting the growth of Cu3Sn and Kirkendall voids in the Cu/Sn-Ag-Cu system by minor Pd alloying
CE Ho, TT Kuo, CC Wang, WH Wu - Electronic Materials Letters, 2012 - Springer
In this study, the metallurgical reaction between Cu substrates (electrolytic type) and a
Sn3Ag0. 5Cu-xPd alloy at 180° C was examined using a scanning electron microscope …
Sn3Ag0. 5Cu-xPd alloy at 180° C was examined using a scanning electron microscope …
Microstructural variation and high-speed impact responses of Sn–3.0 Ag–0.5 Cu/ENEPIG solder joints with ultra-thin Ni–P deposit
CY Ho, JG Duh, CW Lin, CJ Lin, YH Wu… - Journal of Materials …, 2013 - Springer
Abstract Electroless Ni–P/electroless Pd/immersion Au (ENEPIG) with ultra-thin Ni–P deposit
serve as a potential replacement of traditional ENEPIG surface finish because of its superior …
serve as a potential replacement of traditional ENEPIG surface finish because of its superior …
Effect of pd thickness on the interfacial reaction and shear strength in solder joints between sn-3.0 ag-0.5 cu solder and electroless nickel/electroless palladium …
YM Kim, JY Park, YH Kim - Journal of electronic materials, 2012 - Springer
Intermetallic compound formation at the interface between Sn-3.0 Ag-0.5 Cu (SAC) solders
and electroless nickel/electroless palladium/immersion gold (ENEPIG) surface finish and the …
and electroless nickel/electroless palladium/immersion gold (ENEPIG) surface finish and the …
Interfacial reaction and mechanical properties between low melting temperature Sn–58Bi solder and various surface finishes during reflow reactions
Interfacial reactions and joint mechanical reliability of a representative low melting
temperature Sn–58 wt% Bi solder with three different surface finishes were evaluated during …
temperature Sn–58 wt% Bi solder with three different surface finishes were evaluated during …
Effects of Pd concentration on the interfacial reaction and mechanical reliability of the Sn–Pd/Ni system
CE Ho, SW Lin, YC Lin - Journal of alloys and compounds, 2011 - Elsevier
The liquid–solid reaction between Sn–xPd alloy and Ni (x= 0.05–1 wt.%) and the resulting
mechanical reliability of the system were examined in this study. The reactions strongly …
mechanical reliability of the system were examined in this study. The reactions strongly …
The formation and conversion of intermetallic compounds in the Cu pillar Sn–Ag micro-bump with ENEPIG Cu substrate under current stressing
YH Hsiao, KL Lin - Journal of Materials Science: Materials in Electronics, 2016 - Springer
The intermetallic compound growth behavior of Cu pillar micro-bump solder joint, with
electroless Ni/electroless Pd/immersion Au (ENEPIG) metallization on substrate, was …
electroless Ni/electroless Pd/immersion Au (ENEPIG) metallization on substrate, was …
Influence of Pd Concentration on the Interfacial Reaction and Mechanical Reliability of the Ni/Sn-Ag-Cu-xPd System
The interfacial reaction between Ni and Sn-3Ag-0.5 Cu-x Pd alloys (x= 0 wt.% to 1 wt.%) at
250° C and the mechanical reliability of the solder joints were investigated in this study. The …
250° C and the mechanical reliability of the solder joints were investigated in this study. The …
Solder volume effect on the microstructure of solder joints using Au/Pd (P)/Ni (P) surface finish
WH Wu, SW Lin, YC Lin, CE Ho - Procedia Engineering, 2012 - Elsevier
The liquid–solid reaction between Sn3Ag0. 5Cu and Au/Pd (P)/Ni (P) tri–layer with three
different joint diameters (djoint), 200μm, 150μm, and 60μm, were investigated in this study …
different joint diameters (djoint), 200μm, 150μm, and 60μm, were investigated in this study …
Experimental determination and thermodynamic modeling of the Sn-rich corner of the ternary Ni-Pd-Sn phase diagram at 250° C
The Sn-rich portion of the phase diagram for the Ni-Pd-Sn ternary system was preliminarily
obtained by interpolation of the three constituent binary systems using the Muggianu …
obtained by interpolation of the three constituent binary systems using the Muggianu …