Advances in copper nanocrystals: Synthesis, anti-oxidation strategies, and multiple applications

ZX Chen, YJ Song, RZ Li, SJ Guo, L Shi… - Coordination Chemistry …, 2025 - Elsevier
In recent years, copper (Cu) nanocrystals have garnered increasing interest in the field of
metallic nanomaterials due to their low cost and excellent optical and electrical properties …

Low-temperature sintering of Cu@ Ag microparticles in air for recyclable printed electronics

D van Impelen, L González-García… - Journal of Materials …, 2024 - pubs.rsc.org
Silver-coated copper microparticles combine the oxidation resistance of silver with the low
cost of copper. They are interesting components for printed conductive structures. We …

The effects of pressure, temperature, and depth/diameter ratio on the microvia filling performance of Ag-coated Cu micro-nanoparticles for advanced electronic …

G Yang, S Luo, B Luo, Y Zuo, S Ta, T Lin… - … Journal of Smart and …, 2022 - Taylor & Francis
Conductive fillers made from metal nanoparticles offer many advantages for the fabrication
of a variety of electronic devices, but when they have a porous structure, their poor …

A collaborative diffusion mechanism of multiple atoms during Cu–Ag bimetal surface reconstruction

X Yan, X Wang, J Han, X Du, Z Liu… - Physical Chemistry …, 2023 - pubs.rsc.org
The reconstruction of bimetals under reaction conditions is critical for precisely controlling
the catalytic performance of bimetallic catalysts. The surface diffusion mechanisms of Cu …

Preparation of graphene-coated Cu particles with oxidation resistance by flash joule heating

C Zhou, F Qing, X Sun, R Wu, H Wang, Q Wen, X Li - Carbon, 2024 - Elsevier
Cu particles are limited in their applications due to their susceptibility to oxidation. Here we
report a cost-effective method for producing Cu particles with oxidation resistance. By …

[HTML][HTML] Development of Ag@ Si composite sinter joining with ultra-high resistance to thermal shock test for SiC power device: Experiment validation and numerical …

Y Liu, C Chen, Y Wang, Z Zhang, R Liu… - Composites Part B …, 2024 - Elsevier
Owing to its cost-effectiveness and low coefficient of thermal expansion (CTE), micron Si is
incorporated into sintered Ag matrix to develop an Ag@ Si composite sintering strategy. The …

Parametric study on conductive patterns by low-temperature sintering of micron silver ink

M Zhao, G Tang, S Yang, S Fu - RSC advances, 2023 - pubs.rsc.org
The fabrication of dense conductive patterns was achieved by low-temperature sintering of 1–
3 μm micron silver flakes. A small amount of 20–50 nm nanosilver particles were added in …

[HTML][HTML] Silver/graphene oxide composite with high thermal/electrical conductivity and mechanical performance developed through a dual-dispersion medium method

H Wei, Z Zhang, Z Li, L Peng, G Yang, T Zhao… - Journal of Materials …, 2024 - Elsevier
Graphene and its derivatives have excellent thermal conductivity, and are common additives
for metal-based nanocomposites. However, the easy aggregation of graphene and metal …

Synthesis of Imidazole-Compound-Coated Copper Nanoparticles with Promising Antioxidant and Sintering Properties

Y Zhang, X Yu, Z Chen, S Wu, H Lai, S Ta, T Lin… - Micromachines, 2023 - mdpi.com
In this study, we present a facile method for preparing oxidation-resistant Cu nanoparticles
through a liquid-phase reduction with imidazole compounds (imidazole, 2-methylimidazole …

Solvent-free Cu sintering pastes using acidic activators

S Han, G Park, KS Jang - Microelectronics Reliability, 2024 - Elsevier
This study delves into the critical evaluation of solvent-free liquid-type acidic additives for
their effectiveness in the copper (Cu) sintering process, a crucial method for achieving …