This paper gives a review of different applications in the numerical modelling of reflow
soldering technology from recent years. The focus was on detailing the different process …

With the continuous development of advanced packaging technology in heterogeneous
semiconductor integration, the delamination failure problem in a dynamic service …

2.5 D packages have been widely used in electronics industry for high performance and
product miniaturization. As Through-Silicon-Via (TSV) fabrication methods and multi-level …

Moisture induced failure is one of the major reliability concerns in electronic packaging. This
research provides a comprehensive solution for modeling the moisture induced …

Epoxy molding compounds (EMCs) are commonly used in electronic products for chip
encapsulation, but the moisture absorption of EMC can induce significant reliability …

The objective of this research is to investigate the design factors that contribute to the
thermal deformation and stress development of lidless 2.5 D package, and to provide design …

In this study, an accelerated Electromigration (EM) test was performed. The test vehicle has
four types of common interconnect structure. The first one is a classic Ball Grid Array (BGA) …

Epoxy resins are a class of viscoelastic hygroscopic polymers widely used in plastic
packaged devices. Stress relaxation and yielding may occur in plastic packaged devices …

Polymers are highly affected by moisture and temperature in terms of reliability of packaging.
Especially, interface delamination between dissimilar materials with polymer is one of the …

Moisture in the atmosphere could diffuse into plastic packaging devices, which would cause
high hygro-mechanical stress and vapor stress and lead irreversible damages. In this paper …