Organosilicate glass (OSG) films are a critical component in modern electronic devices, with
their electrical properties playing a crucial role in device performance. This comprehensive …

This paper presents an in-depth overview of the application and impact of UV/VUV light in
advanced interconnect technology. UV light application in BEOL historically was mainly …

Organosilicate glass-based porous low dielectic constant films with different ratios of
terminal methyl to bridging organic (methylene, ethylene and 1, 4-phenylene) groups are …

Chemical composition, pore structure and mechanical properties of porous organosilicate
low-k films with terminal and bridging organic groups are studied. It is shown that BTMSE …

Organosilicate-glass films with a varying ratio of terminal methyl and bridging ethylene
groups are synthesized using 1, 2-bis (trimethoxysilyl) ethane/methyltrimethoxysilane …

UV-induced photoluminescence of organosilica films with ethylene and benzene bridging
groups in their matrix and terminal methyl groups on the pore wall surface was studied to …

Carbon-bridged organosilicate films deposited by using different precursors are studied by
both experimentally and theoretically. It is shown that carbon-bridged OSG films have higher …

Modification of spin-on-deposited porous PMO (periodic mesoporous organosilica) ultralow-
k (ULK) SiCOH films (k= 2.33) containing both methyl terminal and methylene bridging …

Low-k dielectric silicon carbonitride (SiC x N y) films are deposited by plasma-enhanced
chemical vapor deposition using a carbon-rich silazane precursor, N-methyl-aza-2, 2, 4 …

Mechanical failures of back-end-of-line (BEoL) interconnects represent a critical yield and
reliability concern for integrating new materials such as ultralow-permittivity (ultralow-k) …