Excellent through‐plane thermally conductive composites are highly demanded for efficient
heat dissipation. Giant sheets have large crystalline domain and significantly reduce …

The fundamental requirements for thermal comfort along with the unbalanced growth in the
energy demand and consumption worldwide have triggered the development and …

Developing advanced thermal interface materials (TIMs) to bridge heat-generating chip and
heat sink for constructing an efficient heat transfer interface is the key technology to solve the …

Heat dissipation has become a central issue for the development of the microelectronic
industry. Thermal interface materials (TIMs) have been widely applied to electron …

With the ever-shrinking characteristic dimension of chips and the increasing of packaging
density, heat dissipation has become the most critical technology challenge for electronic …

Phase change materials (PCMs) as one of the most promising latent heat storage materials
have been applied for thermal management of electronic devices. Nonetheless …

Modern microelectronics and emerging technologies such as wearable electronics and soft
robotics require elastomers to integrate high damping with low thermal resistance to avoid …

With the continuous development of modern electronic equipment, thermal management of
electronic devices has become the focus of attention due to the energy consumption. As an …

Soft elastomers have attracted wide applications, such as soft electronic devices and soft
robotics, due to their ability to undergo large deformation with a small external force. Most …

The challenges associated with heat dissipation in high‐power electronic devices used in
communication, new energy, and aerospace equipment have spurred an urgent need for …