J. Pattillo (57) ABSTRACT A first selection of mesh line segments of a mesh layer are of a
first width and a second selection of mesh line segments of the mesh layer are of a second …

BACKGROUND 1. Technical Field The present invention generally relates to integrated
circuit packaging and in particular to an improved ceramic package. Still more particularly …

BACKGROUND The present invention relates to integrated circuits, and more specifically, to
multi-layered ceramic packages. The packages are usually used for mounting or Supporting …

A mechanism for reducing the vertical cross-talk interference experienced in signal lines due
to the inductive affects from signal lines in other signal planes of a multi-layer ceramic …

A multi-layered ceramic package comprises: a signal layer with identified chip/device area
(s)/site (s) that require a supply of power; and a voltage power (Vdd) layer and a ground …

An electronic package can include modulated mesh planes for reducing crosstalk between
adjacent signal wires within the electronic package. Modulated mesh planes above and …

---(57) ABSTRACT (62) Division of application No. 12/577,259, filed on Oct. 12, 2009, now
Pat. No. 8,288,657. A method reduces coupling noise and controls impedance discontinuity …

(57) ABSTRACT A system and method for reducing noise in a multi-layer ceramic package
are provided. With the system and method, additional shielding wires are inserted into the …

In this paper, we present a methodology for minimizing far-end (FE) noise coupling between
interconnects in high-speed ceramic modules. The high FE noise coupling between signal …

(57) ABSTRACT A mechanism for reducing the vertical cross-talk interfer ence experienced
in signal lines due to the inductive affects from signal lines in other signal planes of a multi …