[PDF][PDF] Electrochemiluminescence Imaging Based on Bipolar Electrochemistry Using Commercially Available Anisotropic Conductive Films.

R Akasaka, K Ino, T Iwama, KY Inoue… - Sensors & …, 2022 - sensors.myu-group.co.jp
Electrochemical imaging has been a widely used tool for analyzing biomolecules and
chemicals. Moreover, several devices and systems have been proposed for electrochemical …

Investigation of process parameters and characterization of nanowire anisotropic conductive film for interconnection applications

J Tao, M Hasan, J Xu, A Mathewson… - IEEE Transactions on …, 2014 - ieeexplore.ieee.org
In this paper, the assessment of the electrical and mechanical performance of the Cu
nanowire anisotropic conductive film (NW-ACF) flip-chip interconnects has been performed …

Nanowire ACF for ultrafine-pitch flip-chip interconnection

KM Razeeb, J Tao, F Stam - Nanopackaging: Nanotechnologies and …, 2018 - Springer
Advanced microelectronic packaging, driven by the multiple benefits of system performance,
power, size and cost, has moved into a three-dimensional (3D) era. One of the bottlenecks to …

Elastic modulus of thermoplastic elastomers investigated with the instantaneous volumetric strain method

S Cheng, S Qian, C Huang, Z Ni… - Journal of Applied …, 2019 - Wiley Online Library
The factors influencing the elastic modulus [K (t)] of thermoplastic elastomers (TPEs) were
investigated under spherical indentation mode with the instantaneous volumetric strain …

Nanowire-Based Anisotropic Conductive Film: A Low Temperature, Ultra-fine Pitch Interconnect Solution

J Tao, A Mathewson, KM Razeeb - IEEE nanotechnology …, 2015 - ieeexplore.ieee.org
Advanced microelectronics packaging, driven by the multiple benefits of system
performance, power, size, and cost, has now entered the three-dimensional (3-D) era …

A configurable multi-rail power and I/O pad applied to wafer-scale systems

N Laflamme-Mayer, Y Blaquière… - … on Circuits and …, 2014 - ieeexplore.ieee.org
We propose in this paper a novel configurable multi-power-rail pad that combines power
supply support circuits and a digital input/output (I/O) buffers designed for a wafer-scale …

[图书][B] Carbon nanomaterial-based interconnects, integrated capacitors and supercapacitors

MA Saleem - 2017 - search.proquest.com
Carbon nanomaterial-based interconnects, integrated capacitors and supercapacitors Page
1 i THESIS FOR THE DEGREE OF DOCTOR OF PHILOSOPHY Carbon nanomaterial-based …

RFIC flip-chip interconnection using a fiber type anisotropic conductive film

T Owada, M Motoyoshi, S Kameda… - … on Radio-Frequency …, 2015 - ieeexplore.ieee.org
Recently, RFIC flip-chip mounting technique is very important to make small size and high
frequency transceivers like mobile phones. The conventional flip-chip mounting uses Au …

Nanowires for 3d silicon interconnection–low temperature compliant nanowire-polymer film for z-axis interconnect

J Tao - 2016 - cora.ucc.ie
Semiconductor chip packaging has evolved from single chip packaging to 3D
heterogeneous system integration using multichip stacking in a single module. One of the …

[PDF][PDF] Nanowire-Based Anisotropic Conductive Film

PILBYG STOCK - academia.edu
MARCH 2015| IEEE nanotEchnology magazInE| 5 the X–Y plane [8]. In traditional ACFs, the
electrical connection is formed by physical contact of the particles to the metal surfaces, and …