Ever since RoHS was implemented in 2006, Sn3. 0Ag0. 5Cu (SAC305) has been the
primary lead-free solder for attaching electronic devices to printed circuit boards (PCBs) …

This paper reviewed the wetting properties of solder for microelectronic packaging. The
recent demand for high-density packaging has highlighted the need for a sophisticated and …

The microstructure and phase composition of Ni-P and Ni-P-Re layers with medium
phosphorus content of 8.8 and 8.2 wt.% of P, respectively, and 6.8 wt.% of Re electroless …

With the trend towards miniaturization and high density in electronics, electrochemical
migration (ECM) of tin-based solder alloys is becoming an increasingly serious issue …

To save test time and cost, spreading area method and wetting balance method were used
to study the wetting characteristics of Ni-GNSs/SnAgCuRE composite solder under different …

Due to safety and reliability concerns, various classes and/or applications of electronic
products are excluded from the European Union's Restriction of Hazardous Substances …

This manuscript details the investigation into the influences of immersion silver (ImAg) and
immersion tin (ImSn) surface finish reflowed with the Sn-3.0 Ag-0.5 Cu (SAC305) solder via …

The effects of copper organic solderability preservative (Cu-OSP) and electroless nickel
immersion gold (ENIG) surface finish reflowed on Sn-3.0 Ag-0.5 Cu (SAC305) solder have …

Purpose The purpose of this paper is to show a possibility to measure a change of a contact
angle during the melting in real-time and to reveal significant factors of a wettability …

Printed circuit board (PCB) is widely used in electronic packaging and plays a role in
supporting the electronic components by providing electrical connections for the circuit's …