Abstract Semiconductor materials including Silicon (Si), Germanium (Ge), Gallium Arsenide
(GaAs), and Silicon Carbide (SiC) are difficult to machine due to their high brittleness and …

Nimonic C-263 superalloy offers a wide range of outstanding properties, namely, high-
temperature resistance, high specific strength, high thermal fatigue, and hot corrosion …

Silicon (Si) micromachining techniques have recently witnessed significant advancement,
attributable to the high surge in demand for microelectromechanical and microelectronic …

The term “nonconventional machining” refers a group of processes that removes material by
various methods involving thermal, electrical, chemical and mechanical energy …

The ever increasing demand of silicon solar cells in PV industry calls for minimizing the
material loses (kerf) during Si wafer slicing. The currently employed abrasive slicing …

The current study looks at surface integrity measures for example surface crack density,
surface roughness, recast layer thickness, and foreign elements content in wire electric …

The objective of this experimental investigation is to reveal the individual effect of wire
electrical discharge cutting (WEDC) process parameters, namely discharge energy density …

The geometric error is very important to the component performance in wire electric
discharge machining (WEDM) process, yet few studies have focused on the geometric error …

Superalloys are commonly used in aircraft manufacturing; however, the requirements for
high surface quality and machining accuracy make them difficult to machine. In this study, a …

Wire electrical discharge machining is an unconventional machining technology that is
crucial in many industries. The surface quality of the machined parts is carefully monitored …