BACKGROUND In the packaging of integrated circuits, semiconductor dies may be stacked
through bonding, and may be bonded to other package components such as interposers …

An embodiment package includes a first die Stack on a Surface of a package component, a
second die stack on the Surface of the package component, and a contour lid over the first …

A handheld device including a circuit board including at least one electronic component, a
heat pipe disposed on the electronic component to absorb heat generated from the …

There is provided a semiconductor device including a substrate whose surface is made of
an insulation material, a semiconductor chip flip-chip connected on the substrate, and a heat …

An embodiment package includes a first die stack on a surface of a package component, a
second die stack on the surface of the package component, and a contour lid over the first …

Provided are a thermal interface material layer and a pack age-on-package device including
the same. The package on-package device may include a thermal interface material layer …

During operation, semiconductor devices generate heat. If inadequately removed, the heat
generated by the semiconduc tor device may cause the device to fail or to perform errati …

BACKGROUND Electrostatic Discharge (ESD) is a rapid discharge that flows between two
objects due to the built-up of static charge. ESD may destroy semiconductor devices …

(57) ABSTRACT A semiconductor package includes a circuit substrate, a die, a frame
structure, a heat sink lid and conductive balls. The die is disposed on a front surface of the …

Embodiments of the present invention provide a chip package including: a substrate having
a first surface and a second surface; a device region located in the substrate; a conducting …