[HTML][HTML] Microstructure evolution at the interface between Cu and eutectic Sn–Bi alloy with the addition of Ag or Ni
O Minho, Y Tanaka, E Kobayashi - Journal of Materials Research and …, 2023 - Elsevier
The study investigated the growth kinetics and rate-controlling processes of intermetallic
layers formed at the interface between Cu and eutectic Sn–Bi alloys with Ag or Ni addition at …
layers formed at the interface between Cu and eutectic Sn–Bi alloys with Ag or Ni addition at …
Growth behavior of intermetallic layers at the interface between Cu and eutectic Sn–Bi by grain boundary diffusion with the grain growth at solid-state temperatures
O Minho, Y Tanaka, E Kobayashi - Intermetallics, 2023 - Elsevier
The growth kinetics and rate-controlling processes of intermetallic layers formed in Cu/(Sn-
58 wt% Bi) diffusion couples were investigated. Isothermal annealing of diffusion couples …
58 wt% Bi) diffusion couples were investigated. Isothermal annealing of diffusion couples …
Crystallinity of Co-P coating on microstructure and mechanical properties of Co-Sn intermetallic compounds at Sn-Ag/Co-P/Cu Interface
S Liu, L Ma, C Zhen, Y Wang, D Li, F Guo - Materials Characterization, 2022 - Elsevier
In advanced microelectronic packaging technology, the interfacial brittleness of Cu/Sn
solder joints puts forward higher requirements for high-performance diffusion barriers …
solder joints puts forward higher requirements for high-performance diffusion barriers …
Investigation of the rate-controlling process of intermetallic layer growth at the interface between ferrous metal and molten Al–Mg–Si alloy
O Minho, K Sato, E Kobayashi - Intermetallics, 2023 - Elsevier
In this study, we focused on unraveling the intricate world of intermetallic compound
formation at the interface of solid Fe and liquid Al–Mg–Si alloy. Our primary aim was to shed …
formation at the interface of solid Fe and liquid Al–Mg–Si alloy. Our primary aim was to shed …
[HTML][HTML] Strategies for solder joints with high shear strength, slow interfacial consumption, ductile intermetallic compounds using hybrid crystalline-amorphous Co-P …
S Liu, L Ma, C Zhen, Y Wang, D Li, F Guo - Materials & Design, 2022 - Elsevier
Crystalline and amorphous cobalt-phosphorus (Co-P) coatings have their own advantages
in interfacial diffusion resistance and mechanical ductility of solder joints, respectively, but it …
in interfacial diffusion resistance and mechanical ductility of solder joints, respectively, but it …
[HTML][HTML] Influence of carbon nanotubes on the morphology of Cu6Sn5 in Cu/(Sn–Ag–Cu) solder joints
M Oh, H Iwamoto, E Kobayashi - Results in Materials, 2024 - Elsevier
This study delves into the intricate interaction between multi-walled carbon nanotubes
(MWCNTs) and the Sn–Ag–Cu solder system, highlighting its relevance in lead-free …
(MWCNTs) and the Sn–Ag–Cu solder system, highlighting its relevance in lead-free …
[HTML][HTML] Understanding Kirkendall effect in Ni (W) diffusion-induced recrystallization region
M Oh, HS Kim, E Kobayashi, M Kajihara - Journal of Alloys and Compounds, 2024 - Elsevier
This study elucidates the formation of distinct phases, such as intermetallic compounds
(IMCs), and the evolution of Kirkendall voids. We not only observed the emergence of …
(IMCs), and the evolution of Kirkendall voids. We not only observed the emergence of …
Microstructural evolution and failure mechanism dominated by Bi, Sb cooperative diffusion at p-type thermoelectric pillar Bi-Sb-Te/Sn interface
Bismuth telluride-based thermoelectric devices have attracted much attention in the field of
low-quality waste heat recovery below 200° C. However, the rapid diffusion at the interface …
low-quality waste heat recovery below 200° C. However, the rapid diffusion at the interface …
Kinetics and thermodynamics of compound growth due to reactive diffusion between solid Cu and binary Bi-Sn alloys
O Minho, H Fujita, E Kobayashi, M Kajihara - Journal of Molecular Liquids, 2022 - Elsevier
The growth behavior of compounds for the reactive diffusion between solid Cu and molten
binary Bi-Sn alloys was experimentally examined using semi-infinite diffusion couples …
binary Bi-Sn alloys was experimentally examined using semi-infinite diffusion couples …
Formation of intermetallic compounds and microstructure evolution due to isothermal reactive diffusion at the interface between solid Co and liquid Sn
N Odashima, MO, M Kajihara - Journal of Electronic Materials, 2020 - Springer
Co has been studied extensively by many research groups as an alternative material for
underbump metallization, since Co–Sn compounds show better mechanical properties than …
underbump metallization, since Co–Sn compounds show better mechanical properties than …