Metals and polymers are extensively used in microelectronics packaging where they are
joined together. Since both the yield and reliability of packages are strongly affected by the …

Copper-oxide coating applied onto the copper substrate has emerged as an alternative to
metallic coatings to improve adhesion with polymeric adhesives and molding compounds …

Electronic packaging designs are moving toward fewer levels of packaging to enable
miniaturization and to increase performance of electronic products. One such package …

Variation of processing conditions on warpage prediction of a plastic quad flat package
(PQFP) is examined. Thermal mismatch between package constituent materials is the major …

The interfacial-adhesion performance between the lead frame and molding compound was
studied after temperature cycles and hygrothermal aging, simulating a typical package …

We show that sandblasting can be employed to effectively enhance the oxidation resistance
of copper by suppressing the interfacial delamination between copper and its oxide by …

A comprehensive study is made of the effects of dimple and finishing material of copper alloy
lead frame on interface adhesion with epoxy moulding compound. The surface plating …

Low cost flip chip on board assemblies are analyzed during the underfill cure process to
determine residual stress generation. In situ stress measurements are performed over the …

Mechanical properties of adhesive joints are degraded in the presence of water. The
progressive decrease in strength has been attributed to propagation of interfacial crack …

This paper reports the adhesion performance of copper alloy substrates with bare surface,
black oxide coating and surface-hardened black oxide coating. In view of optimizing the …