Review on polymer composites with high thermal conductivity and low dielectric properties for electronic packaging

R Li, X Yang, J Li, Y Shen, L Zhang, R Lu, C Wang… - Materials today …, 2022 - Elsevier
Polymers are widely used in electronic packaging due to their easy processing, lightweight,
excellent insulation, and good mechanical properties. However, as electronic devices …

[HTML][HTML] Enhancement of photovoltaic module performance using passive cooling (Fins): A comprehensive review

HA Kazem, AHA Al-Waeli, MT Chaichan… - Case Studies in Thermal …, 2023 - Elsevier
Abstract Photovoltaic-thermal (PV/T) technology, combines the benefits of both solar
photovoltaic (PV) and solar thermal systems into a single integrated solution. It is a …

MXene based advanced materials for thermal energy storage: a recent review

F Jamil, HM Ali, MM Janjua - Journal of Energy Storage, 2021 - Elsevier
Energy storage is a critical issue and it becomes increasingly vital due to rapidly diminishing
of fossil fuels and as renewable energy resources are currently intermittent. The thermal …

Performance improvement in concentrated photovoltaics using nano-enhanced phase change material with graphene nanoplatelets

M Sivashankar, C Selvam, S Manikandan, S Harish - Energy, 2020 - Elsevier
In this paper, the thermal performance of concentrated photovoltaic (CPV) cells using phase
change material (PCM) loaded with graphene nanoplatelets (GnP) is reported …

Numerical investigation and optimization of a heat sink having hemispherical pin fins

D Sahel, L Bellahcene, A Yousfi, A Subasi - … Communications in Heat and …, 2021 - Elsevier
A numerical study was conducted aiming to examine the hydrothermal performance of a
heat sink having hemispherical pin fins (HSPFs) under fully turbulent flow conditions and to …

[HTML][HTML] Experimental investigation for thermal performance enhancement of various heat sinks using Al2O3 NePCM for cooling of electronic devices

I Zahid, M Farhan, M Farooq, M Asim… - Case Studies in Thermal …, 2023 - Elsevier
Electronic devices are being used extensively for different applications, where the thermal
management of these devices is still a critical challenge due to rapid miniaturization, high …

Thermal performance evaluation of PCM-MF composite heat sinks under varying ambient conditions

VR Sreenath, S Chanda - International Journal of Heat and Mass Transfer, 2023 - Elsevier
This study focuses on the effect of ambient conditions and choice of phase change material
(PCM) on the thermal performance of a metal foam (MF)-PCM composite heat sink. The …

Thermal performance of phase change material–based heat sink for passive cooling of electronic components: An experimental study

R Kothari, SK Sahu, SI Kundalwal… - International Journal of …, 2021 - Wiley Online Library
Present paper reports the thermal performance of various phase change material (PCM)‐
based heat sinks during melting process for cooling of portable electronic devices through …

Thermal performance analysis of various heat sinks based on alumina NePCM for passive cooling of electronic components: an experimental study

I Zahid, M Farooq, M Farhan, M Usman, A Qamar… - Energies, 2022 - mdpi.com
In the modern digital world, electronic devices are being widely employed for various
applications where thermal performance represents a significant technical challenge due to …

Passive cooling analysis of an electronic chipset using nanoparticles and metal-foam composite PCM: an experimental study

F Hassan, A Hussain, F Jamil, A Arshad, HM Ali - Energies, 2022 - mdpi.com
Thermal management of electronic components is critical for long-term reliability and
continuous operation, as the over-heating of electronic equipment leads to decrement in …