Methods for hybrid bonding include depositing and patterning a dielectric layer on a
substrate to form openings in the dielectric layer, depositing a barrier layer over the dielectric …

2018-02-20 Assigned to INVENSAS BONDING TECHNOLOGIES, INC. reassignment
INVENSAS BONDING TECHNOLOGIES, INC. ASSIGNMENT OF ASSIGNORS INTEREST …

Representative techniques and devices including process steps may be employed to
mitigate the potential for delamination of bonded microelectronic substrates due to metal …

US11195748B2 - Interconnect structures and methods for forming same - Google Patents
US11195748B2 - Interconnect structures and methods for forming same - Google Patents …

A stacked and electrically interconnected structure is disclosed. The structure can comprise
a first element and a second element directly bonded to the first element along a bonding …

An integrated device package is disclosed. The integrated device package can include an
integrated device die, an element, a cavity, and an electrical interconnect. The ele ment can …

Various embodiments of fanout packages are disclosed. A method of forming a
microelectronic assembly is disclosed. The method can include bonding a first surface of at …

A bonded structure is disclosed. The bonded structure includes a first element and a second
element that is bonded to the first element along a bonding interface. The bonding interface …

Representative techniques and devices, including process steps may be employed to
mitigate undesired dishing in conductive interconnect structures and erosion of dielectric …

A bonded structure is disclosed. The bonded structure can include a first element that has a
first bonding surface. The bonded structure can further include a second element that has a …