Purpose There are several lead-free solder alloys available in the industry. Over the years,
the most favorable solder composition of tin-silver-copper (Sn-Ag-Cu [SAC]) has been vastly …

This paper provides an analytical solution to solve for the electronic assembly random
vibration problem. Additionally, this paper employs Taguchi method to investigate the fatigue …

This paper introduces a reliability performance study of electronic assemblies subjected to
harmonic vibration loading using analytical solutions and response surface methodology …

This paper presents a comprehensive finite element analysis study on the effect of the
support and fixation schemes on the dynamic characteristics and fatigue life of electronic …

Purpose This paper aims to investigate the fatigue life performance of SAC305 ball grid
array solders under combined temperature and harmonic vibration loading conditions …

Experimental and numerical investigations of the vibration reliability of BGA and LGA solder
configurations and SAC105 and 63Sn37Pb solder alloys | Emerald Insight Books and journals …

This paper presents an analytical solution for the electronic assembly subjected to shock
loading transient analysis problem. A previously published solution is adopted here and …

Purpose This paper aims to present a reliability performance assessment of electronic
packages subjected to harmonic vibration loadings by using a statistical factorial analysis …

This paper presents an experimental setup for the evaluation of the lateral deflection of a
three-material composite beam subjected to a concentrated force. The three materials used …

Purpose Because of growing demand for slim, thin and cheap handheld devices, reduced-
volume solder interconnects like land grid array (LGA) are becoming attractive and popular …