Revisión de la literatura sobre el uso del aprendizaje profundo enfocado en sistemas de inspección ópticos automatizados para la detección de defectos superficiales …

J Sanchez-Romero, J Llerena-Izquierdo - Revista InGenio, 2023 - revistas.uteq.edu.ec
El sector de la manufactura utiliza metodologías de aprendizaje automático supervisado
que permiten mejorar procesos de inspección mediante la visión artificial. La inspección …

Drivers and Pathways for the Recovery of Critical Metals from Waste‐Printed Circuit Boards

D Xia, C Lee, NM Charpentier, Y Deng… - Advanced …, 2024 - Wiley Online Library
The ever‐increasing importance of critical metals (CMs) in modern society underscores their
resource security and circularity. Waste‐printed circuit boards (WPCBs) are particularly …

Solder joint inspection on printed circuit boards: A survey and a dataset

F Ulger, SE Yuksel, A Yilmaz… - IEEE Transactions on …, 2023 - ieeexplore.ieee.org
Surface mount technology (SMT) is a procedure for mounting electronic components to the
surface of printed circuit boards (PCBs). Although the SMT procedure is more reliable than …

Segmentation of void defects in X-ray images of chip solder joints based on PCB-DeepLabV3 algorithm

D Kong, X Hu, Z Gong, D Zhang - Scientific Reports, 2024 - nature.com
Defects within chip solder joints are usually inspected visually for defects using X-ray
imaging to obtain images. The phenomenon of voids inside solder joints is one of the most …

Real-time quality inspection based on transfer learning and feature clustering for wave soldering

D Liu, Y Guo, J Xie, H Gao… - IEEE Transactions on …, 2024 - ieeexplore.ieee.org
Accurate quality inspection for wave soldering is crucial to ensure that the products moving
into the next processing step are qualified, which plays a nonnegligible role in reducing …

Detecting anomalous solder joints in multi-sliced PCB X-ray images: A deep learning based approach

H Jayasekara, Q Zhang, C Yuen, M Zhang… - SN Computer …, 2023 - Springer
As the components become smaller and packing becomes denser, printed circuit boards
(PCB) become more prone to mistakes during the assembling. Therefore, solder joint defect …

Comparison of Different NDT Techniques for Evaluation of the Quality of PCBs Produced Using Traditional vs. Additive Manufacturing Technologies

E Jasiūnienė, R Raišutis, V Samaitis, A Jankauskas - Sensors, 2024 - mdpi.com
Multilayer printed circuit boards (PCBs) can be produced not only in the traditional way but
also additively. Both traditional and additive manufacturing can lead to invisible defects in …

SolderNet: Towards trustworthy visual inspection of solder joints in electronics manufacturing using explainable artificial intelligence

H Gunraj, P Guerrier, S Fernandez… - Proceedings of the AAAI …, 2023 - ojs.aaai.org
In electronics manufacturing, solder joint defects are a common problem affecting a variety
of printed circuit board components. To identify and correct solder joint defects, the solder …

A spatial–spectral adaptive learning model for textile defect images recognition with few labeled data

Y Zhang, T Han, B Wei, K Hao, L Gao - Complex & Intelligent Systems, 2023 - Springer
Textile defect recognition is a significant technique in the production processes of the textile
industry. However, in the practical processes, it is hard to acquire large amounts of textile …

P2 random walk: self-supervised anomaly detection with pixel-point random walk

L Hua, Q Qi, J Long - Complex & Intelligent Systems, 2024 - Springer
In the domain of intelligent manufacturing, automatic anomaly detection plays a pivotal role
and holds great significance for improving production efficiency and product quality …