The ability to impart multiple covarying properties into a single material represents a grand
challenge in manufacturing. In the design of block copolymers (BCPs) for directed self …

Downscaling, miniaturization and 3D staking of the micro/nano devices are burgeoning
phenomena in the semiconductor industry which have posed sophisticated challenges in …

An improved understanding of fundamental chemistry, electronic structure, morphology, and
dynamics in polymers and soft materials requires advanced characterization techniques that …

High aspect ratio (HAR) structures found in three-dimensional nand memory structures have
unique process control challenges. The etch used to fabricate channel holes several …

An x-ray scattering based metrology was conceived over 20 years ago as part of a
collaboration between National Institute of Standards and Technology (NIST) and …

Semiconductor devices continue to shrink in size with every generation. These ever smaller
structures are challenging the resolution limits of current analytical and inline metrology …

Laterally periodic nanostructures have been investigated with grazing-incidence small-
angle X-ray scattering (GISAXS) by using the diffraction patterns to reconstruct the surface …

The decreasing size of semiconductor features and the increasing structural complexity of
advanced devices have placed continuously greater demands on manufacturing metrology …

Small‐angle scattering measurements of complex macromolecules in solution are used to
establish relationships between chemical structure and conformational properties …

The directed self-assembly (DSA) of block copolymers (BCPs) is a potential solution for
patterning critical features for integrated circuits at future technology nodes. For this process …