Reliability of Aging in Microstructures for Sn-Ag-Cu Solder Joints with Different Surface Finishes during Thermal Cycling
C Shen - 2016 - search.proquest.com
A direct and deleterious effect on packaging reliability has been observed during elevated
temperature isothermal aging for fine-pitch ball grid array (BGA) packages with Sn-1.0 Ag …
temperature isothermal aging for fine-pitch ball grid array (BGA) packages with Sn-1.0 Ag …