Electronic products are evolving towards miniaturization, high integration, and multi-function,
which undoubtedly puts forward higher requirements for the reliability of solder joints in …

Sn-rich solder joints in three-dimensional integrated circuits and their reliability issues, such
as the electromigration (EM), thermomigration (TM), and thermomechanical fatigue (TMF) …

The effects of Sn orientation and grain boundary misorientation on formation of Cu-Sn
intermetallic compounds (IMCs) during electromigration were investigated. Significant …

With the electronics packaging industry shifting increasingly to three-dimensional
packaging, microbumps have been adopted as the vertical interconnects between chips …

Abstract βSn nucleation is a key step in the formation of microstructure in electronic solder
joints. Here, the heterogeneous nucleation of βSn is studied in undercooled tin droplets …

With the development of the fine pitch technology, the size of the solder bumps contacting
the chip and the substrate has decreased, thereby significantly increasing the current …

Due to the miniaturization of electronic devices, electromigration became one of the serious
reliability issues in lead-free solder joints. The orientation of the β-Sn grain plays an …

The liquid/solid (L/S) interface of dissimilar metals is critical to the microstructure,
mechanical strength, and structural integrity of interconnects in many important applications …

Rapid Cu diffusion is one of the main causes of electromigration (EM) failure in lead-free
solder joints. In this study, an effort has been made to investigate the detrimental effects of …

The diffusion mechanism of Cu in a thin layer of Sn–3.5 Ag sandwiched between two Cu
foils was systematically investigated under a temperature gradient of 2200° C cm− 1 …