Chip spanning connection
J Trezza - US Patent 7,521,806, 2009 - Google Patents
A system has a first chip having first semiconductor devices and first electrical connections, a
second chip having second semiconductor devices and second electrical connections, and …
second chip having second semiconductor devices and second electrical connections, and …
Processed wafer via
J Trezza - US Patent 7,808,111, 2010 - Google Patents
H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the
devices having at least one potential-jump barrier or surface barrier, eg PN junction …
devices having at least one potential-jump barrier or surface barrier, eg PN junction …
Post & penetration interconnection
J Trezza, J Callahan, G Dudoff - US Patent 7,767,493, 2010 - Google Patents
H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state
devices during manufacture or treatment thereof; Apparatus specially adapted for handling …
devices during manufacture or treatment thereof; Apparatus specially adapted for handling …
Integrated circuit packaging system with package stacking and method of manufacture thereof
RA Pagaila, BT Do - US Patent App. 12/957,373, 2011 - Google Patents
(SG)(57) ABSTRACT (21) Appl. No.: 12/957,373 A method of manufacture of an integrated
circuit packaging system includes: forming an encapsulation Surrounding an (22) Filed: Nov …
circuit packaging system includes: forming an encapsulation Surrounding an (22) Filed: Nov …
Thermally balanced via
J Trezza - US Patent 8,283,778, 2012 - Google Patents
H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state
devices during manufacture or treatment thereof; Apparatus specially adapted for handling …
devices during manufacture or treatment thereof; Apparatus specially adapted for handling …
Back-to-front via process
J Trezza - US Patent 7,534,722, 2009 - Google Patents
H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the
devices having at least one potential-jump barrier or surface barrier, eg PN junction …
devices having at least one potential-jump barrier or surface barrier, eg PN junction …
Isolating chip-to-chip contact
J Trezza - US Patent 7,847,412, 2010 - Google Patents
H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state
devices during manufacture or treatment thereof; Apparatus specially adapted for handling …
devices during manufacture or treatment thereof; Apparatus specially adapted for handling …
Through chip connection
J Trezza - US Patent 7,482,272, 2009 - Google Patents
US7482272B2 - Through chip connection - Google Patents US7482272B2 - Through chip
connection - Google Patents Through chip connection Download PDF Info Publication number …
connection - Google Patents Through chip connection Download PDF Info Publication number …
Semiconductor device, manufacturing method for semiconductor device, and electronic equipment
M Fukazawa - US Patent App. 11/473,523, 2007 - Google Patents
(57) ABSTRACT A semiconductor device includes: a plurality of stacked semiconductor
chips including a first semiconductor chip having a side Surface, and a second …
chips including a first semiconductor chip having a side Surface, and a second …
Triaxial through-chip connection
J Trezza - US Patent 7,659,202, 2010 - Google Patents
H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the
devices having at least one potential-jump barrier or surface barrier, eg PN junction …
devices having at least one potential-jump barrier or surface barrier, eg PN junction …