Electronic products are evolving towards miniaturization, high integration, and multi-function,
which undoubtedly puts forward higher requirements for the reliability of solder joints in …

During soldering and service, intermetallic compounds (IMCs) have an important impact on
the performance and reliability of electronic products. A thin and continuous intermetallic …

Currently, the portable electronic products trend to high speed, light weight, miniaturization
and multifunctionality. In that field, solder joint reliability in term of both drop impact and …

The size and crystal orientation of Sn grains in Pb-free, near eutectic Sn-Ag-Cu solder joints
were examined. A clear dependence of the thermomechanical fatigue response of these …

The recrystallization of β-Sn profoundly affects deformation and failure of Sn-Ag-Cu solder
joints in thermomechanical fatigue (TMF) testing. The numerous grain boundaries of …

The extended finite element method enhances the approximation properties of the finite
element space by using additional enrichment functions. But the resulting stiffness matrices …

Solder joint reliability suffers great challenges due to high current density and miniature
solder bump diameter of electronic packages at cryogenic temperature. To tackle these …

Abstract Thermal reliability of Au/Ag interconnection is a crucial factor for the life of solar cell
array during service in space. Although it is known that increasing the heat input can …

Because failures in lead-free solder joints occur at locations other than the most highly shear-
strained regions, reliability prediction is challenging. To gain physical understanding of this …

Ag sinter joining technology is emerging as a die attach material for next-generation power
modules in high-temperature applications. Thermal shock test has revealed that the fracture …