Quantum cascade laser

T Dougakiuchi, K Fujita, A Ito, T Edamura - US Patent 10,008,829, 2018 - Google Patents
A quantum cascade laser is configured with a semiconductor substrate, and an active layer
provided on a first surface of the substrate and having a multistage lamination of unit …

Quantum cascade laser

K Fujita, A Ito, T Edamura, T Dougakiuchi - US Patent 10,014,662, 2018 - Google Patents
A quantum cascade laser is configured with a semiconductor substrate, and an active layer
provided on a first surface of the substrate and having a cascade structure in the form of a …

External resonant laser module

A Sugiyama, T Ochiai, T Edamura… - US Patent App. 17 …, 2022 - Google Patents
The laser module includes a QCL element, a MEMS dif fraction grating, a lens holder for
holding a lens disposed between the QCL element and the MEMS diffraction grat ing, and a …

Quantum cascade laser device

K Fujita, M Hitaka, A Sugiyama, K Shibata - US Patent 12,046,875, 2024 - Google Patents
A quantum cascade laser device includes a semiconductor substrate, an active layer
provided on the semiconductor substrate, and an upper clad layer provided on a side of the …

Method and device for ultraviolet to long wave infrared multiband semiconducting single emitter

GS Kanner, ML Strong III - US Patent 11,804,693, 2023 - Google Patents
A method for generating light emission is provided. The method includes providing a
transistor element including collector, emitter, and base regions, a quantum cascade region …

Generation device and generation method of terahertz waves with orbital angular momentum

Z Zheng, Q Ding - US Patent 10,541,507, 2020 - Google Patents
The present invention relates to a generation device and a generation method of terahertz
waves with orbital angular momentum. The generation device comprises a first laser and a …

Method of manufacturing quantum cascade laser beam source

A Ito, K Fujita, D Kawaguchi, T Dougakiuchi… - US Patent …, 2019 - Google Patents
A method of manufacturing a quantum cascade laser beam source (1) includes: preparing a
semiconductor stacked body (20); forming a pair of first excavated portions (41 and 42) and …