With the rapid advancements in surface mount technology (SMT), microelectronic packaging
products are becoming smaller, denser, and defect-free. This has led to stricter requirements …

Although stencil printing is widely used in surface mount technology, it is believed to be the
main source of majority of defects in the final assembly. Such defects, which could lead to …

The reliability of solder joints in electronic products are greatly enhanced by good stencil
printing and quality reflow soldering. The stencil printing process is widely used in Surface …

A robotic remanufacturing system at Rensselaer has been developed to replace fine pitch
surface mounted components on a populated printed circuit board (PCB). The performance …

This paper presents a novel approach to designing, a low-cost gripper that is highly
repeatable and functionally integrated. The gripper is optimized to compensate for gripping …

The solder paste printing process is an important process in the assembly of Surface Mount
Technology (SMT) devices using the reflow soldering technique. There is a wide agreement …

This paper presents a technique for mapping the modelling of manufacturing processes, in
which process maps are used to represent information on the models and modelling …

Solder paste printing is an important process in surface mount device assembly using the
reflow soldering technique. There is wide agreement in the industry that the paste printing …

A robotic remanufacturing cell system developed at Rensselaer is used to replace a surface
mounted component on a populated Printed Circuit Board (PCB). The performance goal is to …

Wafer bumping is a key process for flip chip packaging. There are several bumping
techniques such as ball drop, electroplating and stencil printing, in which stencil printing is …