Chemical mechanical polishing (CMP) is an essential semiconductor manufacturing process
because of its local and global planarization ability in fabricating highly integrated devices …

Manufacturing paradigms have historically been shaped by social, economic, and
technological aspect, including limitations and needs. Design for manufacturing (DFM) has …

Alumina abrasive has a high polishing rate in the polishing process, but there are issues that
need to be addressed with poor dispersion and poor post-polishing surface quality. This …

In this study, the double sided lapping behavior of sapphire substrate using fixed diamond
abrasive pad was evaluated. For the lapping process, fixed diamond abrasive pad is used …

Driven by electrostatic attraction, Ce 4+ ions or/and positively charged detonation
nanodiamond (DND) particles can absorb onto negatively charged polystyrene (PS) …

The semi-fixed and fixed polishing film with diamond and alumina abrasive are used for a
contrastive experiment involving polishing SiC and sapphire substrates in this study. The …

Sapphire chemical mechanical polishing (CMP) performances using silica particles with
different sizes have been studied. We find that MRR by 10 nm silica slurry could appear …

Sapphire has been the most widely used substrate material in LEDs, and the demand for
non-C-planes crystal is increasing. In this paper, four crystal planes of the A-, C-, M-and R …

Lapping for sapphire substrates was evaluated with respect to material removal modes.
Firstly, a 3-body removal mode that consists of diamond slurry and a metal–resin platen was …

The abrasive is one of the important influencing factors during the chemical mechanical
polishing (CMP) process. Although α-alumina is one of the most commonly used sapphire …