System and method for laser beveling and/or polishing
JP Sercel, M Mendes, R Sarrafi, J Schoenly… - US Patent …, 2019 - Google Patents
Laser processing of hard dielectric materials may include cutting a part from a hard dielectric
material using a continuous wave laser operating in a quasi-continuous wave (QCW) mode …
material using a continuous wave laser operating in a quasi-continuous wave (QCW) mode …
Multi-laser system and method for cutting and post-cut processing hard dielectric materials
JP Sercel, M Mendes, R Sarrafi, J Schoenly… - US Patent …, 2017 - Google Patents
Laser processing of hard dielectric materials may include cutting a part from a hard dielectric
material using a continuous wave laser operating in a quasi-continuous wave (QCW) mode …
material using a continuous wave laser operating in a quasi-continuous wave (QCW) mode …
Multi-laser system and method for cutting and post-cut processing hard dielectric materials
JP Sercel, M Mendes, R Sarrafi, J Schoenly… - US Patent …, 2023 - Google Patents
Laser processing of hard dielectric materials may include cutting a part from a hard dielectric
material using a continuous wave laser operating in a quasi-continuous wave (QCW) mode …
material using a continuous wave laser operating in a quasi-continuous wave (QCW) mode …
Multi-laser system and method for cutting and post-cut processing hard dielectric materials
JP Sercel, M Mendes, R Sarrafi, J Schoenly… - US Patent …, 2020 - Google Patents
Laser processing of hard dielectric materials may include cutting a part from a hard dielectric
material using a continuous wave laser operating in a quasi-continuous wave (QCW) mode …
material using a continuous wave laser operating in a quasi-continuous wave (QCW) mode …
Multiple-beam laser processing using multiple laser beams with distinct wavelengths and/or pulse durations
M Mendes, JP Sercel, R Sarrafi, X Song… - US Patent …, 2018 - Google Patents
Multiple-beam laser processing may be performed on a workpiece using at least first and
second laser beams with different characteristics (eg, wavelengths and/or pulse durations) …
second laser beams with different characteristics (eg, wavelengths and/or pulse durations) …
Systems and methods for laser cleaving diamonds
US12145216B2 - Systems and methods for laser cleaving diamonds - Google Patents
US12145216B2 - Systems and methods for laser cleaving diamonds - Google Patents Systems …
US12145216B2 - Systems and methods for laser cleaving diamonds - Google Patents Systems …
Fiber optic photon engine
I Majid, CH Wang, PC Li - US Patent 10,892,604, 2021 - Google Patents
An aspect of a photon source may have a substrate with a surface, a focus lens disposed
above the surface, and a plurality of optical sources. Each optical source may be composed …
above the surface, and a plurality of optical sources. Each optical source may be composed …
System and method laser for processing of materials
P Tzankov, J Ehrmann, J Kmetec, A Avdokhin… - US Patent …, 2024 - Google Patents
A multiple wavelength laser processing system is configured with a multiple wavelength
laser source for generating a multiple wavelength coaxial laser processing beam. The laser …
laser source for generating a multiple wavelength coaxial laser processing beam. The laser …
Spark plug electrode and method for manufacturing this spark plug electrode and spark plug including a spark plug electrode
Z Tang, D Quest, S Nufer - US Patent 11,056,859, 2021 - Google Patents
A spark plug electrode includes an electrode base body made of a first material and an
ignition element made of a second material and forming an ignition surface for a spark plug …
ignition element made of a second material and forming an ignition surface for a spark plug …
Sealing method
M Itakura, M Katayama, T Uno - US Patent 11,590,608, 2023 - Google Patents
US11590608B2 - Sealing method - Google Patents US11590608B2 - Sealing method - Google
Patents Sealing method Download PDF Info Publication number US11590608B2 US11590608B2 …
Patents Sealing method Download PDF Info Publication number US11590608B2 US11590608B2 …