X Tang, Z Li, L Zeng, H Zhou… - IEEE Journal of the …, 2024 - ieeexplore.ieee.org
Engineers used TCAD tools for semiconductor devices modeling. However, it is computationally expensive and time-consuming for advanced devices with smaller …
M Wang, H Zhou, Y Li, L Zhang, L Zeng… - IEEE Transactions on …, 2023 - ieeexplore.ieee.org
Data-driven machine learning (ML) has emer-ged as an effective approach to providing insights into transistor devices prior to manufacture. Despite its success, most ML methods …
J Choi, H Jeong, S Woo, H Cho, Y Kim… - IEEE Journal of the …, 2023 - ieeexplore.ieee.org
The artificial neural network (ANN)-based compact model has significant advantages over physics-based standard compact models such as BSIM-CMG because it can achieve higher …
W Dai, Y Li, B Peng, L Zhang, R Wang… - … of Electronics Design …, 2023 - ieeexplore.ieee.org
Device modeling with artificial neural networks (ANN) has been explored in the community. However, figure of merits of ANN models in application scenarios have not been fully …
Y Dei, YS Yang, Y Li - 2023 International Conference on …, 2023 - ieeexplore.ieee.org
We propose a compact model that utilizes physical-based artificial neural networks (ANNs) to model the effect of temperature on n-and p-type gate-all-around nanosheet FETs. Our …