C Landesberger, F Robert - US Patent 8,563,358, 2013 - Google Patents
A method of producing a chip package includes providing a substrate comprising a first recess having a recess bottom and recess side walls. A chip comprising a chip backside is …
PJ Schuele, K Sasaki, K Ulmer, JJ Lee - US Patent 9,825,202, 2017 - Google Patents
(57) ABSTRACT A surface mount emissive element is provided with a top surface and a bottom surface. A first electrical contact is formed exclusively on the top surface, and a …
K Sasaki, PJ Schuele, K Ulmer, JJ Lee - US Patent 10,381,335, 2019 - Google Patents
A hybrid light emitting diode (LED) display and fabrication method are provided. The method forms a stack of thin-film layers overlying a top surface of a substrate. The stack includes an …
GW Gengel, MA Hadley, T Pounds, KD Schatz… - US Patent …, 2009 - Google Patents
Abstract A Radio Frequency Identification (RFID) tag. The RFID tag comprises a flexible substrate and an integrated circuit embedded within the flexible substrate. The top surface of …
WJ Ray, MD Lowenthal, NO Shotton… - US Patent …, 2013 - Google Patents
4,152,624. A 5/1979 Knaebel 6,664,560 B2 12/2003 Emerson et al. 4,153,905. A 5, 1979 Charmakadze et al. 6,665,044 B1 12/2003 Jacobsen et al. 4,316,208 A 2, 1982 Kobayashi …
Apparatus and methods are provided for integrally packag ing semiconductor IC (integrated circuit) chips and antenna devices which are integrally constructed from package frame …
WJ Ray, MD Lowenthal, NO Shotton… - US Patent …, 2012 - Google Patents
The present invention provides a method of manufacturing an electronic apparatus, Such as a lighting device having light emitting diodes (LEDs) or a power generating device having …
WJ Ray, MD Lowenthal, NO Shotton… - US Patent …, 2013 - Google Patents
4,152,624. A 5/1979 Knaebel 6,664,560 B2 12/2003 Emerson et al. 4,153,905. A 5, 1979 Charmakadze et al. 6,665,044 B1 12/2003 Jacobsen et al. 4,316,208 A 2, 1982 Kobayashi …