Integrated RTD sensors for maintaining thermal uniformity during TCB process
SB Jemaa, J Sylvestre, P Gagnon - 2019 IEEE 69th Electronic …, 2019 - ieeexplore.ieee.org
Thermocompression bonding (TCB) is an advantageous method adapted for system
miniaturization, for instance to assemble microelectronic devices in 3D stacks. Low …
miniaturization, for instance to assemble microelectronic devices in 3D stacks. Low …
In Situ Measurement Method for Temperature Profile Optimization During Thermocompression Bonding Process
SB Jemaa, P Gagnon, J Sylvestre - IEEE Transactions on …, 2020 - ieeexplore.ieee.org
Thermocompression bonding (TCB) is an important process in electronic packaging and is
widely seen as a promising technology for miniaturized electronic devices. However, this …
widely seen as a promising technology for miniaturized electronic devices. However, this …
Experimental and Numerical Thermal Analysis for Advanced Flip Chip Thermo-Compression Bonding via CMOS Microsensor Arrays and Finite Element Modelling
D Athia - 2017 - uwspace.uwaterloo.ca
Thermo-compression bonding (TCB) relies on uniform thermal distribution during
microelectronic packaging processes to ensure reliable interconnects are formed. During …
microelectronic packaging processes to ensure reliable interconnects are formed. During …
[PDF][PDF] Développement de procédés avancés d'encapsulation de composants microélectroniques basés sur les techniques de thermocompression
SB Jemaa - 2020 - savoirs.usherbrooke.ca
RÉSUMÉ L'un des grands défis de la recherche et développement est d'optimiser
l'ensemble du cycle de fabrication d'un produit microélectronique, depuis sa conception …
l'ensemble du cycle de fabrication d'un produit microélectronique, depuis sa conception …