Interfacial thermal resistance: Past, present, and future

J Chen, X Xu, J Zhou, B Li - Reviews of Modern Physics, 2022 - APS
Interfacial thermal resistance (ITR) is the main obstacle for heat flows from one material to
another. Understanding ITR becomes essential for the removal of redundant heat from fast …

A roadmap review of thermally conductive polymer composites: critical factors, progress, and prospects

Z Wang, Z Wu, L Weng, S Ge, D Jiang… - Advanced Functional …, 2023 - Wiley Online Library
Recently, the need for miniaturization and high integration have steered a strong technical
wave in developing (micro‐) electronic devices. However, excessive amounts of heat may …

Printed transistors made of 2D material-based inks

S Conti, G Calabrese, K Parvez, L Pimpolari… - Nature Reviews …, 2023 - nature.com
Large-area electronics for the Internet of Things requires a new generation of light-weight,
flexible, low-power electronics, based on advanced materials able to provide high …

The advent of thermoplasmonic membrane distillation

S Santoro, AH Avci, A Politano, E Curcio - Chemical Society Reviews, 2022 - pubs.rsc.org
Freshwater scarcity is a vital societal challenge related to climate change, population
pressure, and agricultural and industrial demands. Therefore, sustainable desalination …

Thermal conductivity of graphene-based polymer nanocomposites

X Huang, C Zhi, Y Lin, H Bao, G Wu, P Jiang… - Materials Science and …, 2020 - Elsevier
As a material possessing extremely high thermal conductivity, graphene has been
considered as the ultimate filler for fabrication of highly thermally conductive polymer …

Graphene and its derivatives: understanding the main chemical and medicinal chemistry roles for biomedical applications

TM Magne, T de Oliveira Vieira, LMR Alencar… - Journal of nanostructure …, 2022 - Springer
Over the past few years, there has been a growing potential use of graphene and its
derivatives in several biomedical areas, such as drug delivery systems, biosensors, and …

Three-dimensional integration of two-dimensional field-effect transistors

D Jayachandran, R Pendurthi, MUK Sadaf, NU Sakib… - Nature, 2024 - nature.com
In the field of semiconductors, three-dimensional (3D) integration not only enables
packaging of more devices per unit area, referred to as 'More Moore'but also introduces …

Emerging flexible thermally conductive films: mechanism, fabrication, application

CP Feng, F Wei, KY Sun, Y Wang, HB Lan, HJ Shang… - Nano-micro letters, 2022 - Springer
Effective thermal management is quite urgent for electronics owing to their ever-growing
integration degree, operation frequency and power density, and the main strategy of thermal …

[HTML][HTML] A review of carbon-based thermal interface materials: Mechanism, thermal measurements and thermal properties

X Guo, S Cheng, W Cai, Y Zhang, X Zhang - Materials & Design, 2021 - Elsevier
With the development of electronic technologies, electronic devices become smaller, while
their power density increases dramatically. The resulting excessive heat requires excellent …

Phononics of graphene and related materials

AA Balandin - ACS nano, 2020 - ACS Publications
In this Perspective, I present a concise account concerning the emergence of the research
field investigating the phononic and thermal properties of graphene and related materials …