Advances in interface science over the last 20 years have demonstrated the use of
molecular nanolayers (MNLs) at inorganic interfaces to access emergent phenomena and …

Here we demonstrate the fabrication of novel mesoporous silica/polymer composites using
smart molecular caps and investigate the low dielectric property. For the preparation of …

To put a cap on it: Intelligent caps have been added onto mesoporous walls toward
innovative low-dielectric materials. Appropriately sized caps at the mesopore entrance is …

In order to enable an oxide-free Cu-to-Cu bonding in a (dual) damascene process, 3-
aminopropyltrimethoxysilane-and decanethiol-derived self-assembled monolayers are …

Differential scanning calorimetry studies of the reaction of a cyclolinear polycarbosilane
[cyclo-(CH3Si (CH2) 2SiCH3)-(CH2) 6] n on air-exposed Cu surfaces reveal a substantial …

We report the fabrication of highly densified mesoporous bulk silica consisting of colloidal
mesoporous silica nanoparticles (MSNs) by using a hydrothermal hot-pressing method. No …

Porous silica films as low-k interlayer dielectric were prepared via a sol–gel method.
Tetraethoxysilane (TEOS) was used as raw material and polyvinyl alcohol (PVA) with …

In this study, we prepared mesoporous composite materials templated by poly (ethylene
oxide-b-ε-caprolactone)(PEO-b-PCL) diblock copolymers with the matrix of TEOS and …

Mesoporous silica (MPS) films are attractive for isolating Cu wiring in nanodevices but are
susceptible to pore wall collapse and water and metal uptake. Pore-sealing and chemical …

Functionalizing mesoporous silica (MPS) films with multiple organosilanes is attractive for
tailoring stable low permittivity (low k⁠) dielectrics for nanodevice wiring applications. Here …