Integrating ultra-thin sige bicmos power amplifier chip in combination with flexible antenna in the polymer foil
S Özbek, S Wang, SB Fischer… - … on Circuits and …, 2022 - ieeexplore.ieee.org
In this work, a mechanically flexible and high-speed transmitter front-end system is
presented as a hybrid System-in-Foil (HySiF) by combining Chip-Film Patch (CFP) …
presented as a hybrid System-in-Foil (HySiF) by combining Chip-Film Patch (CFP) …
Advanced Thermal Modeling of IC–Package Interaction
A layout based finite element thermal convection model including detailed board tracing and
packaging information is developed. A state-of-art 0.13-µm SiGe BiCMOS chip with …
packaging information is developed. A state-of-art 0.13-µm SiGe BiCMOS chip with …
An Approach to Verify Electro-thermal Material Stack-up File Based on Modeling of Poly Resistors with Different Geometry
A Datsuk, A Balashov, W Wichmann… - … IEEE Conference of …, 2020 - ieeexplore.ieee.org
An approach to verify a material stack-up file used for electro-thermal simulation is
presented. The proposed technique compares simulation results of electrical simulation …
presented. The proposed technique compares simulation results of electrical simulation …