Investigation of crosstalk issues for MWCNT bundled TSVs in ternary logic
JB Shaik, P Venkatramana - ECS Journal of Solid State Science …, 2022 - iopscience.iop.org
The investigation of crosstalk issues for coupled through silicon vias (TSVs) in ternary logic
is presented in this study. The crosstalk issues are analyzed for coupled TSVs utilizing multi …
is presented in this study. The crosstalk issues are analyzed for coupled TSVs utilizing multi …
[HTML][HTML] Performance analysis of Cu-MWCNT bundled HCTSVs using ternary logic
K Rajkumar, GU Reddy - e-Prime-Advances in Electrical Engineering …, 2023 - Elsevier
This paper presents an investigation of crosstalk issues for coupled heterogeneous coaxial
through silicon vias (HCTSVs) in ternary logic. Crosstalk issues are investigated for coupled …
through silicon vias (HCTSVs) in ternary logic. Crosstalk issues are investigated for coupled …
Impact of polymer liners on crosstalk induced delay of different TSV shapes
M Chandrakar, MK Majumder - IETE Journal of Research, 2024 - Taylor & Francis
The performance of a through silicon via (TSV) based 3D integrated circuit technology is
primarily dependent on the choice of an appropriate liner material. The most commonly used …
primarily dependent on the choice of an appropriate liner material. The most commonly used …
Applying the high-k dielectric materials in vertical multilayer graphene nanoribbon (V-MLGNR) based interconnect for improving transmission performance
P Xu, H Huang, F Zou, L Xie - Micro and Nanostructures, 2024 - Elsevier
In order to solve the electrical performance limitations of horizontal multilayer graphene
nanoribbon (H-MLGNR) based interconnect, a new geometric structure of vertical multilayer …
nanoribbon (H-MLGNR) based interconnect, a new geometric structure of vertical multilayer …
Performance Analysis of CNT Bundle Interconnects in Various Low-k Dielectric Media
M Shefali, K Fatima, PU Sathyakam - ECS Journal of Solid State …, 2022 - iopscience.iop.org
The capacitance of the interconnect, which contributes to RC delay, power, and crosstalk, is
increasingly limiting the performance of ULSI chips as IC technology advances. Different …
increasingly limiting the performance of ULSI chips as IC technology advances. Different …
A comprehensive comparative study of the performance of carbon‐and copper‐based interconnects in ultra‐large‐scale integrated circuits
M Sanaeepur, A Mahmoudi - International Journal of Circuit …, 2021 - Wiley Online Library
Continuous increase of transistor count in ultra‐large‐scale integrated (ULSI) circuits
demands denser interconnection networks to guarantee normal operation. As the distances …
demands denser interconnection networks to guarantee normal operation. As the distances …
A brief review of recent studies on performance improvement of graphene nanoribbon interconnect
An excellent and distinct metal, Copper (Cu), continued to be an extensively used
interconnect material for years. But today, with shrinking technology from millimeter to …
interconnect material for years. But today, with shrinking technology from millimeter to …
Effect of Polymer Liners in Different Via Shapes: Impact on Crosstalk Induced Delay
M Chandrakar, MK Majumder - 2021 - researchsquare.com
The performance of a through silicon via (TSV) based 3D integrated circuit technology is
primarily dependent on the choice of an appropriate liner material. The most commonly used …
primarily dependent on the choice of an appropriate liner material. The most commonly used …