A 3-D multiple-stacked IC has been proposed to support energy efficiency for data center operations as dynamic RAM (DRAM) scaling improves annually. 3-D multiple-stacked IC is a …
Abstract Chip Multiprocessors (CMPs) are here to stay for the foreseeable future. In terms of programmability of these processors what is different from legacy multiprocessors is that …
The celebrated distributed computing approach for building systems and services using multiple machines continues to expand to new domains. Computation devices nowadays …
Aggressive technology scaling in the nano-scale regime makes chips more susceptible to failures. This causes multiple reliability challenges in the design of modern chips, including …