Dynamic temperature information at critical locations has been a critical indicator to safely
use power devices and modules; however, most of the existing 3-D thermal modeling …

The lifetime of power electronic systems is the focus of both the academic and industrial
worlds. Today, compact systems present high switching frequency and power dissipation …

The previous work relating to the numerical-analytical coupling method for steady-state
thermal analysis of the laminated PCB structure is first briefly reviewed. The Fourier-series …

Nowadays, there is a great research effort in the field of electric vehicles. In such a context,
SiC power modules play a key role for their effective and widespread diffusion especially …

Estimation of accurate IGBT junction temperature is crucial for reliability assessment. The
well-known RC lumped approach can help predict junction temperature. However, this …

Double-sided packages for heat dissipation are an efficient thermal management
mechanism for power semiconductor devices. A fan-out panel-level packaging (FOPLP), as …

The stitch wire configuration is widely adopted for large-area IGBT chips. However, an
inhomogeneous wire current density introduces uneven self-heating and nonuniform chip …

This work investigates the effect of the anisotropy on the heat transfer properties of layered
composite materials with discrete heat sources, that are used in the power electronics of …

Characterization and monitoring of the faults in Wide Bandgap-based power modules are
the prerequisites to achieve robust and reliable high density power electronic design. Due to …

The safe operation and lifetime of the power module are heavily dependent on the
temperature distribution, making it imperative to optimize the thermal performance of the …