Thermosonic ball bonding is a metallurgical process that until recently was rarely the subject
of metallurgical analysis. However, in recent years greater focus has been given to the …

The objective of this review is to study the evolution and key findings and critical technical
challenges, solutions and future trend of bonding wires used in semiconductor electronics …

Copper wires are increasingly used in place of gold wires for making bonded
interconnections in microelectronics. There are many potential benefits for use of copper in …

Chapter 1 gives an introduction to Cu wire bonding technology. The advantages of Cu over
Au, such as lower cost, higher mechanical strength, and higher electrical and thermal …

The interfacial shear (IS) force of copper ball onto aluminium-based bond pad in
microelectronics packaging depends on the formation and growth of Cu–Al intermetallic …

A comparison study on the reliability of gold (Au) and copper (Cu) wire bonding is conducted
to determine their corrosion and oxidation behavior in different environmental conditions …

While the characterisation of intermetallic coverage and intermetallic phase (IP) growth in
gold ball bonding on aluminium is quite well understood, there is relatively little literature …

The nanoscale interfacial characteristics of thermosonic copper ball bonding on aluminium
metallization were investigated. It was found that ultrasonic vibration swept oxides of …

Nanosilver paste has become a promising lead-free die-attach material for power electronic
packaging. This development solves the challenges faced by power device manufacturers to …

In this work, we investigate the intermetallic compound formation in Cu wire bonded device.
Voids near the Cu side at the bond interface are clearly seen. Nevertheless, these voids do …