3D printed liquid jet impingement cooler: Demonstration, opportunities and challenges
Liquid jet impingement cooling is a very efficient cooling technology for high performance
devices. Previous studies demonstrated that polymers can be used as a cost effective …
devices. Previous studies demonstrated that polymers can be used as a cost effective …
Effects of multi-cracks and thermal-mechanical coupled load on the TSV reliability
Z Fan, X Chen, Y Jiang, X Li, S Zhang… - Microelectronics Reliability, 2022 - Elsevier
Abstract Three-dimensional (3D) integrated packaging technology is gradually moving from
the laboratory to the market. Through silicon via (TSV) is the most critical structural unit in 3D …
the laboratory to the market. Through silicon via (TSV) is the most critical structural unit in 3D …
Experimental characterization of a chip-level 3-D printed microjet liquid impingement cooler for high-performance systems
The chip-level bare die direct liquid impingement jet cooling is regarded as a highly efficient
cooling solution for high-performance applications. Furthermore, it shows potential to be …
cooling solution for high-performance applications. Furthermore, it shows potential to be …
Expected failures in 3-D technology and related failure analysis challenges
After an introduction to 3-D technology, and through silicon via (TSV)-and stacking options,
this paper provides an overview of failures that can be expected in 3-D technology and lists …
this paper provides an overview of failures that can be expected in 3-D technology and lists …
[HTML][HTML] Direct imaging of the SSD and USB memory drives heating by thermo-elastic optical indicator microscopy
The visualization of mass storage controllers and flash memory chips in the USB2. 0, USB3.
0 and solid state device (SSD) devices was performed using a thermo-elastic optical …
0 and solid state device (SSD) devices was performed using a thermo-elastic optical …
Gigahertz scanning acoustic microscopy analysis of voids in Cu-Sn micro-connects
Gigahertz scanning acoustic microscopy (GHz-SAM) is applied to the characterization of
bulk voids in the Cu-Sn material system, often used in micro-connects. An increased …
bulk voids in the Cu-Sn material system, often used in micro-connects. An increased …
Nondestructive Defect Detection and Localization of Defects in Annular Through Silicon Via (TSV)
D Li, J Su - 2019 Cross Strait Quad-Regional Radio Science …, 2019 - ieeexplore.ieee.org
In the non-ideal manufacturing process of Through Silicon Vias (TSV), many factors
including nonuniform filling, not completely chemical mechanical polishing, tilted vias will …
including nonuniform filling, not completely chemical mechanical polishing, tilted vias will …
Counterfeit identification method of plastic encapsulated microcircuits using scanning acoustic microscope
Y Qiu, SJ Zhang, ZP Chen, Y Li… - Journal of Physics …, 2018 - iopscience.iop.org
Scanning acoustic microscope (SAM) is usually used to detect whether the chips, substrate
and pins of PEMs have delamination, cracks, voids and other defects. In this paper, a …
and pins of PEMs have delamination, cracks, voids and other defects. In this paper, a …
Study of GHz-SAM sensitivity to delamination in BEOL layers
Two different back-end-of-line (BEOL) stacks were indented using Berkovich and wedge tips
with different indentation forces to simulate failure modes such as cracks and delamination …
with different indentation forces to simulate failure modes such as cracks and delamination …
Nanocomposite pastes for thermal and mechanical bonding
T Zhang, B Sammakia, H Wang - 2014 IEEE 64th Electronic …, 2014 - ieeexplore.ieee.org
Heat dissipation is a major challenge in high performance electronic devices. Current
thermal interface materials (TIMs) have either low conductivity, such as conventional thermal …
thermal interface materials (TIMs) have either low conductivity, such as conventional thermal …