Lead-free solders in microelectronics
M Abtew, G Selvaduray - Materials Science and Engineering: R: Reports, 2000 - Elsevier
Practically all microelectronic assemblies in use today utilize Pb–Sn solders for
interconnection. With the advent of chip scale packaging technologies, the usage of solder …
interconnection. With the advent of chip scale packaging technologies, the usage of solder …
Electrochemical migration of Sn and Sn solder alloys: a review
Sn and Sn solder alloys in microelectronics are the most susceptible to suffer from
electrochemical migration (ECM) which significantly compromises the reliability of …
electrochemical migration (ECM) which significantly compromises the reliability of …
Electrodeposition current density induced texture and grain boundary engineering in Sn coatings for enhanced corrosion resistance
A Gupta, C Srivastava - Corrosion Science, 2022 - Elsevier
Sn coatings were electrodeposited over mild steel at different current densities (5 mA cm− 2,
20 mA cm− 2, 40 mA cm− 2, 60 mA cm− 2, and 80 mA cm− 2). Corrosion resistance was …
20 mA cm− 2, 40 mA cm− 2, 60 mA cm− 2, and 80 mA cm− 2). Corrosion resistance was …
Reduction of lead free solder aging effects using doped SAC alloys
The microstructure, mechanical response, and failure behavior of lead free solder joints in
electronic assemblies are constantly evolving when exposed to isothermal aging and/or …
electronic assemblies are constantly evolving when exposed to isothermal aging and/or …
IMC growth of Sn-3.5 Ag/Cu system: Combined chemical reaction and diffusion mechanisms
OM Abdelhadi, L Ladani - Journal of Alloys and Compounds, 2012 - Elsevier
The growth kinetics of intermetallic (IMC) compound layers formed between Sn-3.5 Ag
solders and Cu substrate in soldering process are investigated experimentally and …
solders and Cu substrate in soldering process are investigated experimentally and …
Evaluation of creep behavior of near-eutectic Sn–Ag solders containing small amount of alloy additions
Understanding and quantification of creep behavior of lead-free solder joints are essential
for lifetime prediction of electronic systems. This is especially true for circuits with surface …
for lifetime prediction of electronic systems. This is especially true for circuits with surface …
Effect of different electrolytes on the microstructure, corrosion and whisker growth of pulse plated tin coatings
Pulse electrodeposited tin coatings are produced from different electrolytic baths (acidic
stannous sulfate, alkaline sodium stannate, stannous chloride-citrate, methyl sulfonic acid …
stannous sulfate, alkaline sodium stannate, stannous chloride-citrate, methyl sulfonic acid …
[PDF][PDF] A review of solder evolution in electronic application
E Efzan, A Marini - International Journal of Engineering, 2012 - Citeseer
A REVIEW OF SOLDER EVOLUTION IN ELECTRONIC APPLICATION Page 1 November
2012. Vol. 1, No.1 ISSN 2305-8269 International Journal of Engineering and Applied Sciences …
2012. Vol. 1, No.1 ISSN 2305-8269 International Journal of Engineering and Applied Sciences …
A constitutive model for lead free solder including aging effects and its application to microelectronic packaging
M Motalab - 2013 - search.proquest.com
The microstructure, mechanical response, and failure behavior of lead free solder joints in
electronic assemblies are constantly evolving when exposed to isothermal aging and/or …
electronic assemblies are constantly evolving when exposed to isothermal aging and/or …
[PDF][PDF] Effect of Ag on Sn–Cu and Sn–Zn lead free solders
Lead and lead-containing compounds are considered as toxic substances due to their
detrimental effect on the environment. Sn-based soldering systems, like Sn–Cu and Sn–Zn …
detrimental effect on the environment. Sn-based soldering systems, like Sn–Cu and Sn–Zn …