Multi-chips with an optical interconnection unit

S Cho, K Ha, HY Ryu, S Suh, SG Kim, B Min - US Patent 8,120,044, 2012 - Google Patents
(57) ABSTRACT A multi-chip having an optical interconnection unit is pro vided. The multi-
chip having an optical interconnection unit includes a plurality of silicon chips sequentially …

Stacked photonic chip coupler for SOI chip-fiber coupling

J Jiang - US Patent 9,435,961, 2016 - Google Patents
BACKGROUND Edge coupling is a conventional approach to realize fiber-to-photonic chip
coupling since it can work in a broad range of wavelengths and it is compatible with mature …

Optical interposer

T Collins, S Lardenois - US Patent 9,507,111, 2016 - Google Patents
An optical interposer comprising an array of first order diffraction grating couplers arranged
to couple light emitted by an array of single mode Vertical-Cavity Surface-Emitting Lasers …

Optical waveguide and thermally-assisted magnetic recording head therewith

E Komura, T Chou - US Patent 8,270,791, 2012 - Google Patents
An optical waveguide of the invention includes a core that is a waveguide through which
light propagates; and a cladding that surrounds the core. The core has a plate shape and …

Optical interconnect modules with polymer waveguide on silicon substrate

A Jou, PMJ Wu - US Patent 10,585,250, 2020 - Google Patents
An optical interconnect device on a silicon substrate is disclosed which includes a trench
having two slanted side walls opposite to each other, a number of polymer wave guides …

Grating edge coupler and method of forming same

FE Doany, FR Libsch, J Song - US Patent 9,091,819, 2015 - Google Patents
An apparatus for optical coupling comprises a substrate, a first waveguide formed on the
substrate and includes a grating structure directing light in a first direction, and a second …

Hybrid Silicon Lasers on Bulk Silicon Substrates

DJ Shin, DH Kim, SG Kim, I Joe, K Ha - US Patent App. 14/833,406, 2016 - Google Patents
2015-08-24 Assigned to SAMSUNG ELECTRONICS CO., LTD. reassignment SAMSUNG
ELECTRONICS CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT …

Hybrid grating couplers that overlap via an interconnect structure having a metallization layer

Y Bian, AP Jacob - US Patent 10,185,092, 2019 - Google Patents
Structures for grating couplers and methods of fabricating a structure including grating
couplers. A first grating coupler includes a first plurality of grating structures. An intercon nect …

Three-dimensional optical path with 1× m output ports using SOI-based vertically-splitting waveguides

A Jou, PMJ Wu - US Patent 10,222,564, 2019 - Google Patents
(Continued) Primary Examiner—Andrew Jordan (74) Attorney, Agent, or Firm—Alston & Bird
LLP (57) ABSTRACT A three dimensional optical interconnect device having one input and …

Optical modulator with reduced size and optical transmitter including the same

HC Ji, KH Ha, DJ Shin, JH Pyo, KH Lee - US Patent 8,818,203, 2014 - Google Patents
An optical modulator includes a light input/output unit receiving an incident optical signal
which has not been modulated, splitting the incident optical signal into a first optical signal …