MEMS inductor fabrication and emerging applications in power electronics and neurotechnologies

HT Le, RI Haque, Z Ouyang, SW Lee, SI Fried… - Microsystems & …, 2021 - nature.com
MEMS inductors are used in a wide range of applications in micro-and nanotechnology,
including RF MEMS, sensors, power electronics, and Bio-MEMS. Fabrication technologies …

Carbon nanomaterials for next-generation interconnects and passives: Physics, status, and prospects

H Li, C Xu, N Srivastava… - IEEE Transactions on …, 2009 - ieeexplore.ieee.org
This paper reviews the current state of research in carbon-based nanomaterials, particularly
the one-dimensional (1-D) forms, carbon nanotubes (CNTs) and graphene nanoribbons …

Assembly of micro/nanomaterials into complex, three-dimensional architectures by compressive buckling

S Xu, Z Yan, KI Jang, W Huang, H Fu, J Kim, Z Wei… - Science, 2015 - science.org
Complex three-dimensional (3D) structures in biology (eg, cytoskeletal webs, neural circuits,
and vasculature networks) form naturally to provide essential functions in even the most …

Modeling of mutual coupling between planar inductors in wireless power applications

S Raju, R Wu, M Chan, CP Yue - IEEE Transactions on Power …, 2013 - ieeexplore.ieee.org
This paper presents a compact model of mutual inductance between two planar inductors,
which is essential to design and optimize a wireless power transmission system. The tracks …

Wireless power transfer in loosely coupled links: Coil misalignment model

K Fotopoulou, BW Flynn - IEEE Transactions on magnetics, 2010 - ieeexplore.ieee.org
A novel analytical model of inductively coupled wireless power transfer is presented. For the
first time, the effects of coil misalignment and geometry are addressed in a single …

Frequency-independent equivalent-circuit model for on-chip spiral inductors

Y Cao, RA Groves, X Huang… - IEEE Journal of solid …, 2003 - ieeexplore.ieee.org
A wide-band physical and scalable 2-π equivalent circuit model for on-chip spiral inductors
is developed. Based on physical derivation and circuit theory, closed-form formulas are …

A new analytical calculation of the mutual inductance of the coaxial spiral rectangular coils

Y Cheng, Y Shu - IEEE Transactions on Magnetics, 2013 - ieeexplore.ieee.org
The mutual inductance between two coils is a key parameter in the inductively coupled
wireless power transmission. The spiral rectangular coils are easier to implement than the …

Analysis of the double-layer printed spiral coil for wireless power transfer

K Chen, Z Zhao - IEEE Journal of Emerging and Selected …, 2013 - ieeexplore.ieee.org
As a critical part of the wireless power transfer system via strongly coupled magnetic
resonances, the resonant coils must be cautiously designed for the specific resonant …

Modeling and analysis of through-silicon via (TSV) noise coupling and suppression using a guard ring

J Cho, E Song, K Yoon, JS Pak, J Kim… - IEEE Transactions …, 2011 - ieeexplore.ieee.org
In three-dimensional integrated circuit (3D-IC) systems that use through-silicon via (TSV)
technology, a significant design consideration is the coupling noise to or from a TSV. It is …

Characterization and analysis of on-chip microwave passive components at cryogenic temperatures

B Patra, M Mehrpoo, A Ruffino… - IEEE Journal of the …, 2020 - ieeexplore.ieee.org
This paper presents the characterization and modeling of microwave passive components in
TSMC 40-nm bulk CMOS, including metal-oxide-metal (MoM) capacitors, transformers, and …