Recent advances in 3D printing of biomedical sensing devices
Additive manufacturing, also called 3D printing, is a rapidly evolving technique that allows
for the fabrication of functional materials with complex architectures, controlled …
for the fabrication of functional materials with complex architectures, controlled …
Hardware-accelerated platforms and infrastructures for network functions: A survey of enabling technologies and research studies
In order to facilitate flexible network service virtualization and migration, network functions
(NFs) are increasingly executed by software modules as so-called “softwarized NFs” on …
(NFs) are increasingly executed by software modules as so-called “softwarized NFs” on …
Universal chiplet interconnect express (UCIe): An open industry standard for innovations with chiplets at package level
DD Sharma, G Pasdast, Z Qian… - IEEE Transactions on …, 2022 - ieeexplore.ieee.org
Universal Chiplet Interconnect Express (UCIe) is an open industry standard interconnect for
developing an open chiplet ecosystem, where chiplets from any supplier can be packaged …
developing an open chiplet ecosystem, where chiplets from any supplier can be packaged …
[HTML][HTML] A perspective on the electro-thermal co-design of ultra-wide bandgap lateral devices
Fundamental research and development of ultra-wide bandgap (UWBG) semiconductor
devices are under way to realize next-generation power conversion and wireless …
devices are under way to realize next-generation power conversion and wireless …
8 Tbps co-packaged FPGA and silicon photonics optical IO
K Hosseini, E Kok, SY Shumarayev… - 2021 Optical Fiber …, 2021 - ieeexplore.ieee.org
8 Tbps Co-Packaged FPGA and Silicon Photonics Optical IO Page 1 8 Tbps Co-Packaged
FPGA and Silicon Photonics Optical IO Kaveh Hosseini, Edwin Kok, Sergey Y. Shumarayev …
FPGA and Silicon Photonics Optical IO Kaveh Hosseini, Edwin Kok, Sergey Y. Shumarayev …
Diamond-incorporated flip-chip integration for thermal management of GaN and ultra-wide bandgap RF power amplifiers
D Shoemaker, M Malakoutian… - IEEE Transactions …, 2021 - ieeexplore.ieee.org
GaN radio frequency (RF) power amplifiers offer many benefits including high power
density, reduced device footprint, high operating voltage, and excellent gain and power …
density, reduced device footprint, high operating voltage, and excellent gain and power …
Using Chiplet Encapsulation Technology to Achieve Processing-in-Memory Functions
W Tian, B Li, Z Li, H Cui, J Shi, Y Wang, J Zhao - Micromachines, 2022 - mdpi.com
With the rapid development of 5G, artificial intelligence (AI), and high-performance
computing (HPC), there is a huge increase in the data exchanged between the processor …
computing (HPC), there is a huge increase in the data exchanged between the processor …
ECO-CHIP: Estimation of Carbon Footprint of Chiplet-based Architectures for Sustainable VLSI
CC Sudarshan, N Matkar, S Vrudhula… - … Symposium on High …, 2024 - ieeexplore.ieee.org
Decades of progress in energy-efficient and low-power design have successfully reduced
the operational carbon footprint in the semiconductor industry. However, this has led to …
the operational carbon footprint in the semiconductor industry. However, this has led to …
System on a package innovations with universal chiplet interconnect express (UCIe) interconnect
DD Sharma - IEEE Micro, 2023 - ieeexplore.ieee.org
Universal Chiplet Interconnect Express (UCIe) is an open industry standard interconnect for
developing an open chiplet ecosystem, where chiplets from any supplier can be packaged …
developing an open chiplet ecosystem, where chiplets from any supplier can be packaged …
Glass platform for co-packaged optics
L Brusberg, JR Grenier, AR Zakharian… - IEEE Journal of …, 2023 - ieeexplore.ieee.org
Placing the electrical and photonic chiplets in a single package leads to significant power
reduction. Chiplets are connected by fine-line electrical routing over a length of a few …
reduction. Chiplets are connected by fine-line electrical routing over a length of a few …