Bonded semiconductor substrate including a cooling mechanism
JP Gambino, AK Stamper - US Patent 7,943,428, 2011 - Google Patents
Abonded Substrate comprising two semiconductor Substrates is provided. Each
semiconductor Substrate includes semicon ductor devices. At least one through substrate …
semiconductor Substrate includes semicon ductor devices. At least one through substrate …
Microelectronic elements having metallic pads overlying vias
V Oganesian, I Mohammed, C Mitchell, B Haba… - US Patent …, 2014 - Google Patents
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Koh et al. US PATENT DOCUMENTS 2004/006 1238 A1 4/2004 Sekine 2004/0104454 A1 …
Koh et al. US PATENT DOCUMENTS 2004/006 1238 A1 4/2004 Sekine 2004/0104454 A1 …
Microelectronic elements with rear contacts connected with via first or via middle structures
V Oganesian, B Haba, I Mohammed, C Mitchell… - US Patent …, 2014 - Google Patents
(57) ABSTRACT A microelectronic unit includes a microelectronic element, eg, an integrated
circuit chip, having a semiconductor region of monocrystalline form. The semiconductor …
circuit chip, having a semiconductor region of monocrystalline form. The semiconductor …
Stacked microelectronic assemblies having vias extending through bond pads
M Kriman, O Avsian, B Haba, G Humpston… - US Patent …, 2013 - Google Patents
A stacked microelectronic assembly is provided which includes first and second stacked
microelectronic elements. Each of the first and second microelectronic elements can include …
microelectronic elements. Each of the first and second microelectronic elements can include …
Edge connect wafer level stacking with leads extending along edges
B Haba, V Oganesian - US Patent 8,513,789, 2013 - Google Patents
(57) ABSTRACT A method of making a stacked microelectronic package by forming a
microelectronic assembly by Stacking a first Sub assembly including a plurality of …
microelectronic assembly by Stacking a first Sub assembly including a plurality of …
Wafer level edge stacking
B Haba, I Mohammed, L Mirkarimi, M Kriman - US Patent 8,680,662, 2014 - Google Patents
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2005/0046002 2005/0051883 2005/0056903 2005/0067680 2005/0073035 2005/0095835 …
Staged via formation from both sides of chip
V Oganesian, B Haba, I Mohammed, C Mitchell… - US Patent …, 2014 - Google Patents
2010-11-08 Assigned to TESSERA RESEARCH LLC reassignment TESSERA RESEARCH
LLC ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS) …
LLC ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS) …
Methods of forming semiconductor elements using micro-abrasive particle stream
V Oganesian, B Haba, C Mitchell, I Mohammed… - US Patent …, 2017 - Google Patents
A method of fabricating a microelectronic unit includes providing a semiconductor element
having a front Surface and a rear Surface remote from the front Surface, forming at least one …
having a front Surface and a rear Surface remote from the front Surface, forming at least one …
Multi-function and shielded 3D interconnects
V Oganesian, B Haba, I Mohammed, C Mitchell… - US Patent …, 2013 - Google Patents
22 SO 2 3. semiconductor devices. The microelectronic unit can also include a first
conductive element exposed at the rear Surface for connection with an external component …
conductive element exposed at the rear Surface for connection with an external component …
Edge connect wafer level stacking
B Haba, V Oganesian - US Patent 8,426,957, 2013 - Google Patents
2005/0003649 2005/0012225 2005/0046002 2005/0051883 2005/0056903 2005/0067680
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2005/0073035 2005/0095835 2005/0104179 2005/0156330 2005/0260794 2005/0263866 …