With the development of lead-free solders in electronic packaging, Sn-Cu lead-free solder
has attracted wide attention due to its excellent comprehensive performance and low cost. In …

The restriction of using toxic and harmful Sn-Pb solders has led to the rapid development of
lead-free solders in recent decades. This research on the effect of indium (In) microalloying …

Microalloying, in which the solidification structure is preferably and significantly modified by
trace elements, is a key method for improving Pb-free interconnections in electronic devices …

Trace amount of rare earth Ce (0.03 wt.%) was added into SnAgCu solder in order to reform
the properties of the solder. In this study, interface reaction mechanism during thermal …

The eutectic Sn–0.7 Cu solder alloy is widely used in electronic packaging in which the
creep property of the solder joint is essential to meet the global demand for longer operating …

In this study, the low Ag-content Sn–1.5 Ag–0.7 Cu (SAC157) lead-free solder was modified
for advance electronic components with minor additions of Bi. The microstructure, melt …

Abstract Bi-containing Sn0. 7Cu (SC) eutectic solder alloys were prepared and subjected to
directional solidification, through which new types of fiber reinforced eutectic composites …

The wetting characteristics and microhardness of the Sn-Ag-Cu (SAC) near eutectic alloy
and the effects of a small addition of antimony on these properties have been investigated …

In order to reduce the price of the SAC357 solder, the percentage of silver was reduced and
simultaneously the Bi-element was added to improve the properties of the solder. For this …

This research sought to improve the properties of SAC305 solder joints by the addition of 1
and 2 wt.% Bi. The effects of bismuth doping on the microstructure, thermal properties, and …