Wide bandgap devices in AC electric drives: Opportunities and challenges

AK Morya, MC Gardner, B Anvari, L Liu… - IEEE Transactions …, 2019 - ieeexplore.ieee.org
Wide bandgap (WBG) device-based power electronics converters are more efficient and
lightweight than silicon-based converters. WBG devices are an enabling technology for …

Aging mechanisms and accelerated lifetime tests for SiC MOSFETs: An overview

S Pu, F Yang, BT Vankayalapati… - IEEE Journal of Emerging …, 2021 - ieeexplore.ieee.org
Accelerated lifetime tests (ALTs) play a critical role in long-term reliability studies of SiC
MOSFETs, including lifetime estimation, failure analysis, and condition monitoring. This …

Short-Circuit Characterization and Protection of 10-kV SiC mosfet

S Ji, M Laitinen, X Huang, J Sun… - … on Power Electronics, 2018 - ieeexplore.ieee.org
This paper presents the characterization of the temperature-dependent short-circuit
performance of a Gen3 10 kV/20 A silicon carbide (SiC) mosfet. The test platform consisting …

Improved double pulse test for accurate dynamic characterization of medium voltage SiC devices

H Li, Z Gao, R Chen, F Wang - IEEE Transactions on Power …, 2022 - ieeexplore.ieee.org
This article presents an improved double pulse test (DPT) for accurate dynamic
characterization of the medium voltage (MV) silicon carbide device. The difference between …

Performance of parallel connected sic mosfets under short circuits conditions

R Wu, S Mendy, N Agbo, JO Gonzalez, S Jahdi… - Energies, 2021 - mdpi.com
This paper investigates the impact of parameter variation between parallel connected SiC
MOSFETs on short circuit (SC) performance. SC tests are performed on parallel connected …

A survey on recent advances of medium voltage silicon carbide power devices

B Hu, X Lyu, D Xing, D Ma, J Brothers… - 2018 IEEE Energy …, 2018 - ieeexplore.ieee.org
Medium voltage (MV) Silicon Carbide (SiC) power devices have become available as
engineering samples. Recent studies show that they outperform their Silicon (Si) …

Review of methodologies for evaluating short-circuit robustness and reliability of SiC power MOSFETs

R Cui, Z Xin, Q Liu, J Kang, H Luo… - IEEE Journal of …, 2021 - ieeexplore.ieee.org
To accelerate the broad application of silicon carbide (SiC) power MOSFETs, their short-
circuit (SC) robustness and reliability must be thoroughly evaluated. This article, therefore …

Design of a fan-out panel-level SiC MOSFET power module using ant colony optimization-back propagation neural network

Y Qian, F Hou, J Fan, Q Lv, X Fan… - IEEE Transactions on …, 2021 - ieeexplore.ieee.org
A new panel-level silicon carbide (SiC) metal oxide semiconductor field effect transistor
(MOSFET) power module was developed by using the fan-out and embedded chip …

Genetic Algorithm–Assisted Design of Redistribution Layer Vias for a Fan-Out Panel-Level SiC MOSFET Power Module Packaging

J Fan, Y Qian, W Chen, J Jiang, Z Tang… - 2022 IEEE 72nd …, 2022 - ieeexplore.ieee.org
A fan-out panel-level packaging (FOPLP) with an embedded redistribution layer (RDL) via
interconnection reduces the size, thermal resistance, and parasitic inductance of power …

A temperature-dependent analytical model of SiC MOSFET short-circuit behavior considering parasitic parameters

P Xiang, R Hao, X You - … of Emerging and Selected Topics in …, 2021 - ieeexplore.ieee.org
The superior electrical and thermal characteristics of silicon carbide (SiC) MOSFETs bring
major challenges to its short-circuit reliability. To fully understand its short-circuit mechanism …