Embodiments of a polishing article for processing a substrate are provided. In one
embodiment, a polishing article for processing a substrate comprises a fabric layer having a …

The invention relates to a method of polishing a substrate comprising at least one metal
layer by applying an electro chemical potential between the substrate and at least one …

Embodiments of a ball assembly are provided. In one embodiment, a ball assembly includes
a housing, a ball, a conductive adapter and a contact element. The housing has an annular …

800 plurality of grooves disposed in the polishing Surface. The article of manufacture may
be used in a processing system. The article of manufacture may be used in a method for …

An article of manufacture and apparatus are provided for planarizing a substrate surface. In
one aspect, an article of manufacture is provided for polishing a substrate including …

(57) ABSTRACT A method and apparatus for a planarizing or polishing article for
Electrochemical Mechanical Planarization (ECMP) is disclosed. The polishing article is a …

(63) Continuation-in-part of application No. 09/505,899,(57) ABSTRACT filed on Feb. 17,
2000, now Pat. No. 6,537,144, and a continuation-in-part of application No. 10/033,732 …

(54) CONDUCTIVE POLISHING ARTICLE FOR 2001, noW Pat. No. 7,066,800, Which is a
continua ELECTROCHEMICAL MECHANICAL tion-in-part of application No. 09/505,899 …

Embodiments of a ball assembly are provided. In one embodiment, a ball assembly includes
a housing, a ball, a conductive adapter and a contact element. The housing has an annular …

(21) Appl. No.: 10/140,010(57) ABSTRACT (22) Filed: May 7, 2002 An article of
manufacture, method, and apparatus are pro OO Vided for planarizing a Substrate Surface …