Thermal management system for press-pack IGBT based on liquid metal coolant

Y Yerasimou, V Pickert, S Dai… - IEEE Transactions on …, 2020 - ieeexplore.ieee.org
The press-pack packaging technology has been adopted in recent years for insulated-gate
bipolar transistors (IGBTs) to be utilized in high voltage-high current applications, such as …

Thermal and mechanical analyses of clamping area on the performance of press-pack IGBT in series-connection stack application

S Dai, Z Wang, H Wu, X Song, G Li… - IEEE Transactions on …, 2021 - ieeexplore.ieee.org
Press-pack insulated gate bipolar transistors (PP-IGBTs) are commonly connected in series
and stacked together with heatsinks using an exterior clamping fixture in order to achieve …

Aging monitoring method of bond wires-based on phase-frequency characteristics of differential mode conducted interference signal for IGBT module

C Chu, C Dong, J Hu, M Du… - IEEE Transactions on …, 2021 - ieeexplore.ieee.org
This paper presents an on-line monitoring method of IGBT module bond wires aging based
on the phase-frequency characteristics (PFCs) of differential mode (DM) interference signal …

[PDF][PDF] Thermal Management System for Press-Pack IGBT based on Liquid Metal Coolant

Z Wang - ieeexplore.ieee.org
The press-pack packaging technology has been adopted in recent years for insulated-gate
bipolar transistors (IGBTs) to be utilized in high voltage–high current applications, such as …