Abstract Networks− on− chip (NoC) are an alternative to alleviate the problems of legacy
interconnect fabrics. However, many emerging technology NoC are developed and are now …

3D ICs can take advantage of a scalable communication platform, commonly referred to as
the Networks-on-Chip (NoC). In the basic form of 3D-NoC, all routers are vertically …

Monolithic-3D-integration (M3D) improves the performance and energy efficiency of 3D ICs
over conventional through-silicon-vias-based counterparts. The smaller dimensions of …

Methods, storage mediums, and apparatuses for evaluating the reliability of Three-
Dimensional (3D) Network-on-Chip (NoC) designs are described. The described …

The component's failure in network-on-chips (NoCs) has been a critical factor on the
system's reliability. In order to alleviate the impact of faults, fault tolerance has been …

One of the cost-efficient fabrication approaches for connecting layers in three-dimensional
integrated circuits (3D ICs) is the use of through-silicon vias (TSVs). However, the large and …

A three-dimensional Network-on-Chip (3D NoC) equips modern multicore processors with
good scalability, a small area, and high performance using vertical through-silicon vias …

Many synthesis works discussed emerging technology networks− on− chip (NoC) from
different aspects. These works were and still are a solid foundation of the state of the art for …

Abstract Network-on-Chip (NoC)-based communication architecture is promising in
addressing the communication bottlenecks in current and future multicore processors. In this …

Rapid scaling of transistor gate sizes has significantly increased the density of on-chip
integrations and paved the way for many-core systems-on-chip with highly improved …