Glass-based packaging presents unique opportunities for supporting 5G and beyond
frequencies. In this work, we present the first broadband characterization results for the …

A recently developed material technology at Corning Inc., namely, Alumina Ribbon Ceramic
(ARC), is investigated as a potential substrate candidate for fifth generation (5G) and …

Liquid crystal polymer is a promising substrate for mm-wave packaging. In this work, we
present the characterization of liquid crystal polymer from 110 GHz to 170 GHz. The …

New material technologies must be explored to realize high-performance packages for
meeting the stringent requirements defined in the fifth generation (5G) and sub-THz …

As the sensitivity of optogalvanic spectroscopy based on prototype microplasma sources
increases, contamination from composite materials in the printed circuit board used starts to …

This paper presents an alternative method to material characterization by using a low-cost
rapid prototyping technique to fabricate microstrip ring resonators. After the design of the …