With the implementation of legislations on inhibiting the usage of Sn–Pb solder in consumer
electronic products, Sn–Ag–Cu series solder has been gotten the most application …

As to promote the performance of the solder joints applied to electronics industry, the
researchers take advantage of micro/nano-sized particles or another element coated on …

During the past decades, series of lead-free solders have been developed rapidly, and are
considered as the attractive interconnection materials replacing traditional Sn-Pb solders in …

Sn-based lead-free solders such as Sn-Ag-Cu, Sn-Cu, and Sn-Bi have been used
extensively for a long time in the electronic packaging field. Recently, low-temperature Sn-Bi …

This study reviews the existing research on the effects of surface roughness on the
wettability and intermetallic compound (IMC) layer formation in lead-free solder joints. The …

SnBi lead-free solder is widely applied in the field of low-temperature soldering due to its
excellent creep resistance, relatively low melting point (139° C) and cost. However, the …

With the development of microelectronic packaging and increasingly specific service
environment of solder joints, much stricter requirements have been placed on the properties …

The microstructure, IMCs layer and reliability of Sn-58Bi and Sn-58Bi-0.25 Mo solder joints
during thermal cycling were investigated. The results showed that the microstructure of Sn …

Low temperature solder (In-based, Sn-Bi, Sn-Zn) has great advantages in aerospace and
through-hole technology assemblies in IBM mainframe due to its unique low temperature …

Over the past few years Sn-based solders containing third and fourth elements have
become of great interest to try and improve the consistency of solders during application. In …