This review compares the mechanical and thermal-electrical properties of sintered copper
(Cu) with sintered silver (Ag) as bonding materials in the microelectronics joint applications …

After about three decades of development, the polyol process is now widely recognized and
practised as a unique soft chemical method for the preparation of a large variety of …

A review is provided, which first considers low-temperature diffusion bonding with silver
nanomaterials as filler materials via thermal sintering for microelectronic applications, and …

One of the biggest challenges in microscale additive manufacturing is the production of
three-dimensional, microscale metal parts with a high enough throughput to be relevant for …

A novel all‐femtosecond‐laser‐processing technique is proposed for the fabrication of 2D
periodic metal nanostructures inside 3D glass microfluidic channels, which have …

Conductive inks have gathered increasing attention in the fabrication of next-generation
electronic devices because of their prominent compatibility and producibility. Recently …

Highly conductive Cu–Cu interconnections of SiC die with Ti/Ni/Cu metallization and direct
bonded copper substrate for high-power semiconductor devices are achieved by the low …

CO2 hydrogenation to ethanol is of practical importance but poses a significant challenge
due to the need of forming one C–C bond while keeping one C–O bond intact. CuI centers …

We have developed a new method for preparing a paste containing a high concentration of
Ag nanoparticles for pressureless bonding. A nanoscale layer of polyvinylpyrrolidone coated …

An oxidation-reduction bonding (ORB) was applied to achieve Cu-Cu bonding with
microscale Cu particle paste. During sintering at 300° C, Cu 2 O nanoparticles were …