Copper plating can provide significant cost savings over screen printed Ag for industrially
produced Si photovoltaic modules, however concerns exist with regard to the durability of …

We report the first investigation into the potential of electroless nickel deposition to form
ohmic contacts on single layer graphene. To minimize the contact resistance on graphene, a …

Despite relatively high manufacturing cost, crystalline-Si solar cell continues to hold
promising future due to its high energy conversion efficiency and long life. As regards cost …

In this study, the impact of impurities incorporated into plated nickel seed layer on silicide
formation and the influence of annealing temperature on the fill-factor (FF) loss of solar cells …

This work aims to investigate the effect of the bath composition, current density and
annealing conditions on the properties of the electrodeposited nickel (Ni) seed layer for …

Nickel galvanic displacement (NiGD) plating to silicon surfaces allows for the deposition of
self-limiting sub-micron nickel layers. This paper reports the use of NiGD plating as an …

Efficient metal contact formation is pivotal for the production of cost‐effective, high‐
performance crystalline silicon (Si) solar cells. Traditionally, screen‐printed silver (Ag) …

Light-induced electroless plating (LIEP) is an easy and inexpensive method that has been
widely used for seed layer deposition of Nickel/Copper (Ni/Cu)-based metallization in the …

Electrical contact formation is required for the transport of generated current from solar cells.
Currently, Ag screen printing is the dominant metallisation method, but it accounts for~ 60 …

In order to enable higher conversion efficiencies, commercially-produced p-type solar cell
devices of the future will require the minimisation of front surface (emitter) recombination …